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For mils Found Datasheets File :: 5816 Search Time::1.234ms
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				Central Semiconductor Corp
Part No.	CP382X
OCR Text	...ess details die size 26 x 26 mils die thickness 5.9 mils base bonding pad area 5.5 x 5.5 mils emitter bonding pad area 5.5 x 5.5 mils top side metalization al - 30,000? back side metalization au - 12,000? www.centralsemi.c...
Description	Small Signal Transistor NPN - Low VCE(SAT) Transistor Chip
File Size	727.03K / 2 Page	View it Online	Download Datasheet

				Motorola
Part No.	MCCF3334
OCR Text	... 1 mil dia. raised minimum 0.5 mils above passivated chip surface sense ground power ground 20 mils 20 mils 20 mils 50 mils 66 2 mils 76 2 mils 1 2 3 4 5.5 1 6 +1 s1 c mc3334 mcc3334 mccf3334 5 motorola analog ic device data p suffix...
Description	HIGH ENERGY IGNITION CIRCUIT
File Size	111.84K / 6 Page	View it Online	Download Datasheet


Part No.	MAAMSS0026TR-3000
OCR Text	...2 c5 c6 c7 l1 c3 c4 c1 c2 c8 55 mils 800 - 1000 mhz schematic l1 c6 c5 c7 l3 l2 c1 c4 c2 c3 50 ? 8 o 50 ? 8 o 50 ? 2 o 50 ? 5 o c8 l1 c6 c5 c7 l3 l2 c1 c4 c2 c3 50 ? 8 o 50 ? 8 o 50 ? 2 o 50 ? 5 o c8 rf driver amplifier, 50 - 5...
Description	50 MHz - 5000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
File Size	397.10K / 8 Page	View it Online	Download Datasheet

				Central Semiconductor Corp
Part No.	CPZ37R
OCR Text	...s details die size 6.7 x 6.7 mils die thickness 3.54 mils anode bonding pad area 4.3 x 4.3 mils top side metalization al - 13,000? back side metalization au-as/ag - 13,000?/6,000? www.centralsemi.com r0 (16-march 2012)
Description	12 Volt TVS Chip
File Size	156.50K / 1 Page	View it Online	Download Datasheet

				Central Semiconductor Corp
Part No.	CPZ35R
OCR Text	...details die size 10.2 x 10.2 mils die thickness 3.9 mils cathode bonding pad area 7.1 mils diameter top side metalization al - 30,000? back side metalization au - 12,000? www.centralsemi.com r0 (5-january 2012) process ...
Description	3.3 Volt TVS Chip
File Size	600.99K / 2 Page	View it Online	Download Datasheet

				Central Semiconductor Corp
Part No.	CPZ34R
OCR Text	...s details die size 6.7 x 6.7 mils die thickness 3.54 mils anode bonding pad area 4.5 x 4.5 mils top side metalization al - 30,000? back side metalization au.as - 12,000? www.centralsemi.com r0 (17-january 2013) process ...
Description	6.2 Volt TVS Chip
File Size	611.35K / 2 Page	View it Online	Download Datasheet

				Central Semiconductor Corp
Part No.	CPZ33R
OCR Text	...details die size 14.2 x 14.2 mils die thickness 3.9 mils cathode bonding pad areas (4) 4.7 mils diameter each top side metalization al - 13,000? back side metalization au - 12,000? www.centralsemi.com r0 (3-january 2012) pr...
Description	12 Volt Quad TVS Chip
File Size	659.72K / 2 Page	View it Online	Download Datasheet

For mils Found Datasheets File :: 5816 Search Time::1.234ms
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