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  85013-3299 Datasheet PDF File

For 85013-3299 Found Datasheets File :: 93+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 |   

    0850132828 85013-2828

Molex Electronics Ltd.
Part No. 0850132828 85013-2828
Description 2.54mm (.100) Pitch DIN 41612 Header, Vertical, 3-Row C-Pin, Press-Fit Style R Male

File Size 215.91K  /  5 Page

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Amphenol Communications Solutions

Part No. 10132990-002TRLF
Description Minitek® 2.00mm, Board to Board, Unshrouded Vertical Header, Surface Mount, Double Row, 6 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0850132000 85013-2000

Molex Electronics Ltd.
Part No. 0850132000 85013-2000
Description 2.54mm (.100) Pitch DIN 41612 Header, Style R/2 Reverse, 32 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Style R/2 Reverse, 32 Circuits

File Size 114.75K  /  5 Page

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Amphenol Communications Solutions

Part No. 89073-299LF
Description Metral® Board Connectors, Backplane Connectors, 4 Row Signal Header, Straight, Press-Fit, 1 Mod.
Tech specs    

Official Product Page

    0850132012 85013-2012

Molex Electronics Ltd.
Part No. 0850132012 85013-2012
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse1μm (40μ) Selective Gold (Au), 48 Circuits, Lead free
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse1渭m (40渭") Selective Gold (Au), 48 Circuits, Lead free

File Size 267.35K  /  8 Page

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Amphenol Communications Solutions

Part No. 10132990-001TRLF
Description Minitek® 2.00mm, Board to Board, Unshrouded Vertical Header, Surface Mount, Double Row, 4 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    0850133213 85013-3213

Molex Electronics Ltd.
Part No. 0850133213 85013-3213
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1渭m (40渭) Selective Gold (Au), 96 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1μm (40μ) Selective Gold (Au), 96 Circuits, Lead free

File Size 128.74K  /  5 Page

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Amphenol Communications Solutions

Part No. 95278-501-30LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    0850130050 85013-0050

Molex Electronics Ltd.
Part No. 0850130050 85013-0050
Description 2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse

File Size 266.38K  /  8 Page

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Amphenol Communications Solutions

Part No. 95278-501-34LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    0850133225 85013-3225

Molex Electronics Ltd.
Part No. 0850133225 85013-3225
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1μm (40μ) Selective Gold (Au), 64 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1楼矛m (40楼矛) Selective Gold (Au), 64 Circuits, Lead free

File Size 125.17K  /  5 Page

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Amphenol Communications Solutions

Part No. 95278-501-38LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    0850132127 85013-2127

Molex Electronics Ltd.
Part No. 0850132127 85013-2127
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse, 1μm (40μ) Selective Gold (Au), 48 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse, 1楼矛m (40楼矛) Selective Gold (Au), 48 Circuits, Lead free

File Size 159.01K  /  6 Page

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Amphenol Communications Solutions

Part No. 95278-501-36LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    0850130062 85013-0062

Molex Electronics Ltd.
Part No. 0850130062 85013-0062
Description 2.54mm (.100) Pitch DIN 41612 Header, Vertical, C-Pin Press-Fit Style R/2 Reverse0.6μm (24μ) Selective Gold (Au), 32 Circuits, Lead free
2.54mm (.100") Pitch DIN 41612 Header, Vertical, C-Pin Press-Fit Style R/2 Reverse0.6楼矛m (24楼矛") Selective Gold (Au), 32 Circuits, Lead free

File Size 312.27K  /  6 Page

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Amphenol Communications Solutions

Part No. 95278-501-32LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    85013-3196 0850133196

Molex Electronics Ltd.
Part No. 85013-3196 0850133196
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse, 1μm (40μ) Selective Gold (Au), 48 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse, 1渭m (40渭) Selective Gold (Au), 48 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse, 1楼矛m (40楼矛) Selective Gold (Au), 48 Circuits, Lead free

File Size 161.37K  /  6 Page

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    0850131225

Molex Electronics Ltd.
Part No. 0850131225
Description 2.54mm (.100) Pitch DIN 41612 Header, Vertical, C-Pin Press-Fit Style R Reverse, 1μm (40μ) Selective Gold (Au), 96 Circuits, Lead free

File Size 80.61K  /  3 Page

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