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  6081 Datasheet PDF File

For 6081 Found Datasheets File :: 106+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 |   

    K4F640812D K4F660812D K4F640812D-JCL

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4F640812D K4F660812D K4F640812D-JCL
Description 8M x 8bit CMOS dynamic RAM with fast page mode. 3.3V, 4K refresh cycle.

File Size 367.41K  /  20 Page

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Amphenol Communications Solutions

Part No. 10106268-0608101LF
Description PwrBlade+® , Power Connectors, 2LP+8S+1LP+8S+2LP+8S+1LP+8S STB, Vertical, Receptacle.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0011-18-5077 0011185077 60816A106

Molex Electronics Ltd.
Part No. 0011-18-5077 0011185077 60816A106
Description Conductor Punch
   Conductor Punch

File Size 22.28K  /  1 Page

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Amphenol Communications Solutions

Part No. 10137926-0811LF
Description Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and Hold Down Header, Tin plating, Black Color, 8 Positions, GW Compatible LCP, Tape and Reel with cap.
Tech specs    

Official Product Page

    K4E640812B K4E660812B K4E640812B-JC-45 K4E640812B-JC-5 K4E640812B-JC-6 K4E640812B-JCL-45 K4E640812B-JCL-5 K4E640812B-JCL

SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4E640812B K4E660812B K4E640812B-JC-45 K4E640812B-JC-5 K4E640812B-JC-6 K4E640812B-JCL-45 K4E640812B-JCL-5 K4E640812B-JCL-6 K4E640812B-TC-45 K4E660812B-JC-6 K4E660812B-JC-45 K4E660812B-JC-5
Description 8M x 8bit CMOS dynamic RAM with extended data out, 45ns
8M x 8bit CMOS dynamic RAM with extended data out, 50ns
8M x 8bit CMOS dynamic RAM with extended data out, 60ns

File Size 415.47K  /  21 Page

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Amphenol Communications Solutions

Part No. 54122-106081000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    K4E660812E-JC/L K4E640812E-JC/L K4E660812E-TC/L K4E640812E-TC/L K4E660812E-TL45

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4E660812E-JC/L K4E640812E-JC/L K4E660812E-TC/L K4E640812E-TC/L K4E660812E-TL45
Description 8M X 8 EDO DRAM, 45 ns, PDSO32
8M x 8bit CMOS Dynamic RAM with Extended Data Out 8米8位的CMOS动态随机存储器的扩展数据输
(K4E640812E / K4E660812E) 8M x 8bit CMOS Dynamic RAM with Extended Data Out

File Size 194.12K  /  21 Page

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Amphenol Communications Solutions

Part No. 10128638-160816CLF
Description HPCE R/A Receptacle 40P
Tech specs    

Official Product Page

    A-7720-WA08F501B 0022456081 22-45-6081

Molex Electronics Ltd.
Part No. A-7720-WA08F501B 0022456081 22-45-6081
Description 2.54mm (.100") KK庐 IDT Double Cantilever Contact, 8 Circuits, Gold (Au), Feed-Through, 22 AWG Wire
2.54mm (.100) KK? IDT Double Cantilever Contact, 8 Circuits, Gold (Au), Feed-Through, 22 AWG Wire

File Size 476.94K  /  20 Page

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Amphenol Communications Solutions

Part No. 59202-S30-06-081LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 12 Positions.
Tech specs    

Official Product Page

   
Part No. K4E160811D-BL60 K4E170811D-BC50
Description 2M X 8 EDO DRAM, 60 ns, PDSO28
2M X 8 EDO DRAM, 50 ns, PDSO28

File Size 259.46K  /  21 Page

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Amphenol Communications Solutions

Part No. 54121-806081050LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

   
Part No. K4E660812D-TI50 K4E660812D-JI45 K4E640812D-JP45
Description 8M X 8 EDO DRAM, 50 ns, PDSO32
8M X 8 EDO DRAM, 45 ns, PDSO32

File Size 197.47K  /  21 Page

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Amphenol Communications Solutions

Part No. 10125138-160816ALF
Description HPCE STD VT Receptacle 40P
Tech specs    

Official Product Page

   
Part No. K4F660811D-TC60 K4F660811D-JC60 K4F660811D-JC50 K4F640811D-TC50 K4F640811D-TC60
Description 8M X 8 FAST PAGE DRAM, 60 ns, PDSO32
8M X 8 FAST PAGE DRAM, 50 ns, PDSO32

File Size 370.53K  /  20 Page

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Amphenol Communications Solutions

Part No. 59112-F36-08-106LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 16 Positions.
Tech specs    

Official Product Page

    1N6080 1N6076 1N6079 1N6074 1N6081 1N6073 1N6075 1N6077 1N6078 JANTX1N6075

MICROSEMI[Microsemi Corporation]
Part No. 1N6080 1N6076 1N6079 1N6074 1N6081 1N6073 1N6075 1N6077 1N6078 JANTX1N6075
Description ULTRA FAST POWER RECTIFIERS
ULTRA FAST POWER RECTIFIERS
Ultra Fast Rectifier (less than 100ns)

File Size 70.51K  /  2 Page

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Amphenol Communications Solutions

Part No. 54112-106081350LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    K4F170811D K4F170812D K4F160811D K4F160812D

SAMSUNG[Samsung semiconductor]
Part No. K4F170811D K4F170812D K4F160811D K4F160812D
Description 2M x 8Bit CMOS Dynamic RAM with Fast Page Mode

File Size 224.28K  /  20 Page

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Amphenol Communications Solutions

Part No. 10137926-0812LF
Description Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and Hold Down Header, Tin plating, Black Color, 8 Positions, Non GW Compatible LCP, Tape and Reel with cap.
Tech specs    

Official Product Page

For 6081 Found Datasheets File :: 106+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 |   

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