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  2816-4 Datasheet PDF File

For 2816-4 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    Samsung Electronic
Part No. K4H281638D
Description 128Mb DDR SDRAM Data Sheet

File Size 317.02K  /  51 Page

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Amphenol Communications Solutions

Part No. 54122-816523000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 52 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87914-2816 0879142816

Molex Electronics Ltd.
Part No. 87914-2816 0879142816
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.54K  /  48 Page

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Amphenol Communications Solutions

Part No. 59202-S28-16-050LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 32 Positions.
Tech specs    

Official Product Page

    HMN12816D-85I HMN12816D HMN12816D-120 HMN12816D-120I HMN12816D-150 HMN12816D-150I HMN12816D-70 HMN12816D-70I HMN12816D-8

Electronic Theatre Controls, Inc.
Hanbit Electronics Co.,Ltd
ETC[ETC]
List of Unclassifed Manufacturers
Part No. HMN12816D-85I HMN12816D HMN12816D-120 HMN12816D-120I HMN12816D-150 HMN12816D-150I HMN12816D-70 HMN12816D-70I HMN12816D-85
Description Non-Volatile SRAM MODULE 2Mbit (128K x 16-Bit), 40pin-Dip, 5V 非易失性SRAM模块即可移植28K的x 16位)0pin浸,5V

File Size 143.52K  /  9 Page

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Amphenol Communications Solutions

Part No. 54122-128161250LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    44428-1606 0444281606

Molex Electronics Ltd.
Part No. 44428-1606 0444281606
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, Dual Row, Right Angle, without Snap-in Plastic Peg PCB Lock, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, without Snap-in Plastic Peg PCB Lock, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 232.70K  /  4 Page

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Amphenol Communications Solutions

Part No. 77315-428-16LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    0877582816

Molex Electronics Ltd.
Part No. 0877582816
Description MOLEX Connector

File Size 170.91K  /  4 Page

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Amphenol Communications Solutions

Part No. 68682-816
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Through Hole, Dual Entry, Double Row, 32 Position ,2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    44428-1603 0444281603

Molex Electronics Ltd.
Part No. 44428-1603 0444281603
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 232.70K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-816442250LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 44 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    SAMSUNG[Samsung semiconductor]
Part No. K1S2816BCM-I K1S2816BCM
Description 8Mx16 bit Page Mode Uni-Transistor Random Access Memory

File Size 132.33K  /  10 Page

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Amphenol Communications Solutions

Part No. 54112-816122500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    44428-1602 0444281602

Molex Electronics Ltd.
Part No. 44428-1602 0444281602
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in

File Size 232.75K  /  4 Page

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Amphenol Communications Solutions

Part No. 59112-G28-16-050LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 32 Positions.
Tech specs    

Official Product Page

    44428-1601 0444281601

Molex Electronics Ltd.
Part No. 44428-1601 0444281601
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 16 Circuits, Tin (Sn) Plating
3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 16 Circuits, Tin (Sn) Plating

File Size 232.70K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-816202500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    EMD28164PA EMD28164PA-60 EMD28164PA-75 EMD28164PA-90

Emerging Memory & Logic Solutions Inc
Part No. EMD28164PA EMD28164PA-60 EMD28164PA-75 EMD28164PA-90
Description 128M: 8M x 16 Mobile DDR SDRAM

File Size 764.51K  /  45 Page

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Amphenol Communications Solutions

Part No. 54122-816202500LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

For 2816-4 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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