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  1140-5343 Datasheet PDF File

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    Pulse Engineering, Inc.
Part No. H1140
Description
File Size 173.82K  /  4 Page

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Amphenol Communications Solutions

Part No. 1140084168
Description 1140084168-Micro SD Normal Open H=1.55 NONE PUSH
Tech specs    

Official Product Page

HUA FENG CIRCUIT





   
Part No. 21140-AF
Description 0 CHANNEL(S), 100M bps, LOCAL AREA NETWORK CONTROLLER, PQFP144

File Size 314.99K  /  55 Page

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Amphenol Communications Solutions

Part No. 380-5343-20W
Description Receptacle,INFINX,6 Pair 14 Position 12MM,100MΩ, w/lossy
Tech specs    

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    1140-4027

Molex Electronics Ltd.
Part No. 1140-4027
Description Conductor Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 68653-432HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54mm Pitch, Vertical, 13.72mm (0.54in) Mating, 2.41mm (0.095in) Tail.
Tech specs    

Official Product Page

    Carlo Gavazzi
TE Connectivity, Ltd.
Part No. P-A3-11400-01 P-A3-11400-02
Description GENERAL PURPOSE INDUCTOR

File Size 124.09K  /  1 Page

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Amphenol Communications Solutions

Part No. 68653-434HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54mm Pitch, Vertical, 13.72mm (0.54in) Mating, 2.41mm (0.095in) Tail.
Tech specs    

Official Product Page

   
Part No. 21140-AE
Description LAN Node Controller

File Size 1,022.35K  /  55 Page

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Amphenol Communications Solutions

Part No. 68685-343LF
Description Dubox®, Board to Board connector, PCB Mounted Receptacle, Vertical, Through Hole, Top Entry, Single Row, 43 positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    1140-4032

Molex Electronics Ltd.
Part No. 1140-4032
Description Insulation Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 68653-435HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54mm Pitch, Vertical, 13.72mm (0.54in) Mating, 2.41mm (0.095in) Tail.
Tech specs    

Official Product Page

    1140-4127

Molex Electronics Ltd.
Part No. 1140-4127
Description Insulation Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 75915-343HLF
Description Dubox® 2.54mm, Board to Board Connector,Vertical Receptacle, Through Hole, Single row , 43 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    1140-4031

Molex Electronics Ltd.
Part No. 1140-4031
Description Conductor Punch

File Size 14.29K  /  1 Page

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Amphenol Communications Solutions

Part No. 68653-431HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54mm Pitch, Vertical, 13.72mm (0.54in) Mating, 2.41mm (0.095in) Tail.
Tech specs    

Official Product Page

    Digital Equipment
Part No. 21140
Description DEC Chip

File Size 1,461.58K  /  43 Page

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Amphenol Communications Solutions

Part No. 68653-430HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54mm Pitch, Vertical, 13.72mm (0.54in) Mating, 2.41mm (0.095in) Tail.
Tech specs    

Official Product Page

    D1140

Toshiba Semiconductor
Part No. D1140
Description Search --To 2SD1140

File Size 224.30K  /  4 Page

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Amphenol Communications Solutions

Part No. 68653-433HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54mm Pitch, Vertical, 13.72mm (0.54in) Mating, 2.41mm (0.095in) Tail.
Tech specs    

Official Product Page

For 1140-5343 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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