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  0874.100MXEP Datasheet PDF File

For 0874.100MXEP Found Datasheets File :: 93+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 |   

    0874270248

Molex Electronics Ltd.
Part No. 0874270248
Description
File Size 245.61K  /  4 Page

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Amphenol Communications Solutions

Part No. 10087452-102HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Press Fit, Single Row, 2 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0874270402 87427-0402

Molex Electronics Ltd.
Part No. 0874270402 87427-0402
Description 4.20mm (.165") Mini-Fit Jr. Header, Right Angle, High Temperature, without Flange, 4 Circuits
4.20mm (.165) Mini-Fit Jr. Header, Right Angle, High Temperature, without Flange, 4 Circuits

File Size 245.66K  /  4 Page

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Amphenol Communications Solutions

Part No. 10087452-106HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Press Fit, Single Row, 6 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0874270403

Molex Electronics Ltd.
Part No. 0874270403
Description
File Size 160.55K  /  4 Page

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Amphenol Communications Solutions

Part No. 10087452-110001HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Press Fit, Single Row, 10 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0874270642 87427-0642

Molex Electronics Ltd.
Part No. 0874270642 87427-0642
Description 4.20mm (.165) Mini-Fit Jr. Header, Vertical, High Temperature, without Flange, 6 Circuits, Tin (Sn) over Nickel (Ni) Plating, Glow Wire Compatible
4.20mm (.165) Mini-Fit Jr.?/a> Header, Vertical, High Temperature, without Flange, 6 Circuits, Tin (Sn) over Nickel (Ni) Plating, Glow Wire Compatible

File Size 228.91K  /  4 Page

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Amphenol Communications Solutions

Part No. 10150874-102LF
Description AirMAX VS2®, Backplane Connectors, 5-Pair, 8 Column, 120-Position, 2.0mm, , Right Angle Header, Press-Fit
Tech specs    

Official Product Page

    0874270802 87427-0802

Molex Electronics Ltd.
Part No. 0874270802 87427-0802
Description 4.20mm (.165) Mini-Fit Jr. Header, Right Angle, High Temperature, without Flange8 Circuits, Tin (Sn) over Nickel (Ni) Plating, Glow Wire Compatible

File Size 245.66K  /  4 Page

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Amphenol Communications Solutions

Part No. 10087452-110HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Press Fit, Single Row, 10 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    TCD2901D EE08749

TOSHIBA[Toshiba Semiconductor]
Part No. TCD2901D EE08749
Description From old datasheet system
CCD IMAGE SENSOR

File Size 443.53K  /  13 Page

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    0874270643

Molex Electronics Ltd.
Part No. 0874270643
Description
File Size 245.89K  /  4 Page

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    0874270842 87427-0842

Molex Electronics Ltd.
Part No. 0874270842 87427-0842
Description 4.20mm (.165") Mini-Fit Jr. Header, Vertical, High Temperature, without Flange, 8 Circuits
4.20mm (.165) Mini-Fit Jr. Header, Vertical, High Temperature, without Flange, 8 Circuits

File Size 228.91K  /  4 Page

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    0874270843 87427-0843

Molex Electronics Ltd.
Part No. 0874270843 87427-0843
Description 4.20mm (.165) Mini-Fit Jr. Header, Vertical, High Temperature, without Flange, 8Circuits, Tin (Sn) over Copper (Cu) Plating, Glow Wire Compatible

File Size 228.91K  /  4 Page

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    0874271002 87427-1002

Molex Electronics Ltd.
Part No. 0874271002 87427-1002
Description 4.20mm (.165") Mini-Fit Jr. Header, Right Angle, High Temperature, without Flange, 10 Circuits
4.20mm (.165) Mini-Fit Jr. Header, Right Angle, High Temperature, without Flange, 10 Circuits

File Size 245.66K  /  4 Page

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For 0874.100MXEP Found Datasheets File :: 93+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 |   

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