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MACOM[Tyco Electronics]
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| Part No. |
MAAPGM0060-DIE
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| OCR Text |
...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply... |
| Description |
Amplifier, Power, 5W 4.8-6.7 GHz
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| File Size |
355.06K /
5 Page |
 View
it Online |
Download Datasheet
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MACOM[Tyco Electronics]
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| Part No. |
MAAPGM0053-DIE
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| OCR Text |
...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply ne... |
| Description |
Amplifier, Distributed Power, 0.5 W 2.0-18.0 GHz
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| File Size |
336.22K /
5 Page |
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it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MAAPGM0052-DIE
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| OCR Text |
...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply ne... |
| Description |
Amplifier, Distributed Power 4.0-18.0 GHz
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| File Size |
331.53K /
6 Page |
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it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MAAPGM0044-DIE
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| OCR Text |
...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply ne... |
| Description |
Amplifier, Power, 0.5W 11.5-16.5 GHz
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| File Size |
252.14K /
5 Page |
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it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MAAPGM0042-DIE
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| OCR Text |
...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply ne... |
| Description |
1.2W X/Ku-Band Power Amplifier 11.5-16.0 GHz
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| File Size |
420.43K /
6 Page |
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it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MAAPGM0041-DIE
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| OCR Text |
...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply ne... |
| Description |
1.3W X/Ku-Band Power Amplifier 11.0-15.0 GHz
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| File Size |
253.62K /
6 Page |
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it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MAAPGM0038-DIE
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| OCR Text |
...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply ne... |
| Description |
1.2W C/Ku-Band Power Amplifier 7.5-13.5 GHz
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| File Size |
334.38K /
6 Page |
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it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MAAPGM0037-DIE
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| OCR Text |
...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply... |
| Description |
Amplifier, Power, 1.0W 6.5-12.5 GHz
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| File Size |
185.25K /
5 Page |
View
it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MAAPGM0036-DIE
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| OCR Text |
...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply ne... |
| Description |
1.2-3.2 GHz 1.2W Power Amplifier
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| File Size |
247.95K /
6 Page |
View
it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MAAPGM0034-DIE
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| OCR Text |
...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply ne... |
| Description |
0.5W X/Ku-Band Power Amplifier 8.0-12.5 GHz
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| File Size |
268.13K /
6 Page |
View
it Online |
Download Datasheet |
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