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MC14068 DAT15015 TPUD4006 TLE4268 2SD1892 PD064VT DUR14 48220
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    Micron Technology, Inc.
Part No. MT18LD472AG MT9LD272AG
OCR Text ...en low prior to cas# falling. a late write or read-modify-write occurs when we# falls after cas# was taken low. during early write cycles, the data-outputs (q) will remain high-z regardless of the state of oe#. during late write or read-mod...
Description 4Meg x 72 Nonbuffered DRAM DIMMs(4M x 72无缓冲动态RAM双列直插存储器模
2Meg x 72 Nonbuffered DRAM DIMMs(2M x 72无缓冲动态RAM双列直插存储器模 2Meg × 72 Nonbuffered内存插槽00万72无缓冲动态RAM的双列直插存储器模块

File Size 416.63K  /  30 Page

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    Siemens
Part No. 3TH4 3TH4004-0A 3TH4355-0A 3TH4244-0B 3TH4244-0A 3TH4394-0B 3TH4031-0A 3TH4031-0B 3TH4280-0B 3TH4280-0A 3TH4022-0A 3TH4022-0B 3TH4454-0A 3TH4454-0B 3TH4373-0A
OCR Text ... No of Contacts Code Early Make late Break Catalog No (Coil Suffix required from table below) Price $ No of Contacts Code DC Operation Contact Type Early Make late Break Catalog No (Coil Suffix required from table below) Price $ NO NC...
Description Control Relays

File Size 56.06K  /  1 Page

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    INTEGRATED SILICON SOLUTION INC
Part No. IS61LSCS51236-333B
OCR Text ..., such as burst rams, nbt rams, late write, or double data rate (ddr) srams. the logical differences between the protocols employed by these rams hinge mainly on various combinations of address bursting, output data registering and write cu...
Description 512K X 36 STANDARD SRAM, 1.6 ns, PBGA209

File Size 181.09K  /  33 Page

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    GS8160ZV18AT-333I

GSI TECHNOLOGY
Part No. GS8160ZV18AT-333I
OCR Text ...or other pipelined read/double late write or flow through read/ single late write srams, allow u tilization of all available bus bandwidth by eliminating the need to insert deselect cycles when the device is switched fr om read to write...
Description 1M X 18 ZBT SRAM, 4.7 ns, PQFP100

File Size 490.98K  /  23 Page

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    Micron Technology, Inc.
Part No. MT8LD864AG-5X MT16LD1664AG-5X MT32LD3264AG-5X MT16LD1664AG-6X MT8LD864AG-6X MT32LD3264AG-6X
OCR Text ...en low prior to cas# falling. a late write or read-modify-write oc- curs when we# falls after cas# was taken low. during early write cycles, the data-outputs (q) will remain high-z regardless of the state of oe#. during late write or read-m...
Description DRAM MODULE
Silver Mica Capacitor; Capacitance:8200pF; Capacitance Tolerance: /- 5%; Series:CDV30; Voltage Rating:1000VDC; Capacitor Dielectric Material:Mica; Termination:Radial Leaded; Lead Pitch:11.1mm; Leaded Process Compatible:No RoHS Compliant: No
Silver Mica Capacitor; Capacitance:1000pF; Capacitance Tolerance: /- 5%; Series:CDV30; Voltage Rating:1500VDC; Capacitor Dielectric Material:Mica; Termination:Radial Leaded; Lead Pitch:11.1mm; Leaded Process Compatible:No RoHS Compliant: No

File Size 509.43K  /  27 Page

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    K7K3236U2C K7K3218U2C

Samsung semiconductor
Part No. K7K3236U2C K7K3218U2C
OCR Text ...s pipeline read with self timed late write. * Read latency : 2.5 clock cycles * Registered address, control and data input/output. * DDR(Double Data Rate) Interface on read and write ports. * Fixed 2-bit burst for both read and write operat...
Description 1Mx36 & 2Mx18 DDRII CIO b2 SRAM

File Size 439.18K  /  19 Page

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    Micron Technology, Inc.
Part No. MT9LD272A
OCR Text ...en low prior to cas# falling. a late write or read-modify-write occurs when we# falls after cas# was taken low. during early write cycles, the data-outputs (q) will remain high-z regardless of the state of oe#. during late write or read-mod...
Description 2, 4 MEG x 72 NONBUFFERED DRAM DIMMs

File Size 423.00K  /  30 Page

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