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Molex Electronics Ltd.
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Part No. |
87911-1811 0879111811
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Description |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 18 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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File Size |
360.87K /
6 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
72479-1111LF
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Description |
Metral® Board Connectors, Backplane Connectors, 5 Row, Round Cable Connector Kit, 60 Positions, for 24 AWG to 26 AWG Conductors, Standard Latch.
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
87911-2811 0879112811
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Description |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 28 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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File Size |
360.88K /
6 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10128479-119500ULF
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Description |
ExaMEZZ® 56Gb/s High Speed Mezzanine Connector System, Hermaphroditic, Vertical, Press-Fit, 2 Pair, 13 Column, 104 Position, 19.50mm Stack Height, 2.00mm (0.079in) Column Pitch
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
87911-5411 0879115411
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Description |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 54 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 54 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 54 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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File Size |
360.88K /
6 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10145179-110KLF
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Description |
Minitek MicroSpace™ 1.27mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Vertical, Header, Surface Mount, 10 Position,side to side double row,Top latch<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68779-116HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 16 Positions, 2.54 mm (0.100in)Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
87911-7811 0879117811
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Description |
2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 78 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 78 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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File Size |
360.88K /
6 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10127791-101LF
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Description |
ExaMAX® 56Gb/s High Speed Backplane Connector 92Ohm, 6-Pair, 10 column, 200 position, Vertical Header, No Guide Pin.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
87911-3607 0879113607
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Description |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free 2.54mm (.100") Pitch C-Grid庐 Header, Right Angle, Through Hole, 36 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tube Packaging, Lead-free
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File Size |
486.74K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10037911-103LF
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Description |
Mechanical Guidance Modules, Backplane Connectors, 10.8mm Guide Pin-Internal Thread.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
87911-3611 0879113611
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Description |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 36 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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File Size |
360.90K /
6 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68779-118HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 18 Positions, 2.54 mm (0.100in)Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10127791-11JLF
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Description |
ExaMAX® 56Gb/s High Speed Backplane Connector 92Ohm, 6-Pair, 10 column, 200 position, Vertical Header, Right Guide Pin.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10037911-104LF
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Description |
Mechanical Guidance Modules, Backplane Connectors, 10.8mm Guide Pin-Internal Thread.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0879111411 87911-1411
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Description |
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 14 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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File Size |
360.70K /
6 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10127791-12JLF
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Description |
ExaMAX® 56Gb/s High Speed Backplane Connector 92Ohm, 6-Pair, 10 column, 200 position, Vertical Header, Left Guide Pin.
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Tech specs |
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Official Product Page
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Price and Availability
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