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  74026-8324 Datasheet PDF File

For 74026-8324 Found Datasheets File :: 113+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 |   

    0878324821 87832-4821

Molex Electronics Ltd.
Part No. 0878324821 87832-4821
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree, 48 Circuits, 0.76μm (30μ) Gold (Au) Plating
2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree, 48 Circuits, 0.76μm (30μ) Gold (Au) Plating
MOLEX Connector

File Size 386.46K  /  6 Page

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Amphenol Communications Solutions

Part No. 75374-026LF
Description PV® Wire-to-Board Connector System, Crimp to Wire Receptacle for 0.48mm (0.019in)
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0878324421 87832-4421

Molex Electronics Ltd.
Part No. 0878324421 87832-4421
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 44 Circuits, 0.76μm (30μ) Gold (Au) Plating
2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 44 Circuits, 0.76μm (30μ) Gold (Au) Plating
MOLEX Connector

File Size 386.52K  /  6 Page

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Amphenol Communications Solutions

Part No. 88874-026LF
Description Quickie® IDC Cable-to-Board Connector System, Shrouded Header, Right Angle, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    CY28324 CY28324PVC

SpectraLinear Inc
Part No. CY28324 CY28324PVC
Description FTG for Intel? Pentium? 4 CPU and Chipsets

File Size 208.38K  /  21 Page

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Amphenol Communications Solutions

Part No. 88874-026
Description Quickie®, Wire to Board Connector, Double Row, 26 Positions, 2.54 mm (0.1 in.), Right Angle Header 0.76 um (30 u\\.) Gold Mating Plating
Tech specs    

Official Product Page

    CY28324PVC CY28324

SpectraLinear Inc
Part No. CY28324PVC CY28324
Description FTG for Intel㈢ Pentium㈢ 4 CPU and Chipsets

File Size 204.23K  /  21 Page

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Amphenol Communications Solutions

Part No. 68683-242LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 84 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    CY28324 CY28324PVC

CYPRESS[Cypress Semiconductor]
Part No. CY28324 CY28324PVC
Description FTG for Intel Pentium 4 CPU and Chipsets

File Size 182.67K  /  23 Page

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Amphenol Communications Solutions

Part No. 68683-243LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 86 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    D945GCPE D98324-001US

Intel Corporation
Part No. D945GCPE D98324-001US
Description Technical Product Specification

File Size 3,070.95K  /  80 Page

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Amphenol Communications Solutions

Part No. 68683-247LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 94 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    KS88C8324 KS88C8316

SAMSUNG[Samsung semiconductor]
Part No. KS88C8324 KS88C8316
Description SAM87 family of 8-bit single-chip CMOS microcontrollers offers a fast and efficient CPU

File Size 89.81K  /  19 Page

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Amphenol Communications Solutions

Part No. 86832-418HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 18 Positions, 2.54 mm Pitch, Vertical, 8.26 mm (0.325 in.) Mating, 2.54 mm (0.1 in.) Tail.
Tech specs    

Official Product Page

    Electronic Theatre Controls, Inc.
Part No. M13S128324A
Description Modify typing error of Pin Arrangement 修改输入错误的管脚配

File Size 805.48K  /  48 Page

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Amphenol Communications Solutions

Part No. 86832-438HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 8.26 mm (0.325 in.) Mating, 2.54 mm (0.1 in.) Tail.
Tech specs    

Official Product Page

    Elite Semiconductor Mem...
Part No. M53S128324A-2E
Description Bi-directional data strobe (DQS)

File Size 1,159.84K  /  47 Page

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Amphenol Communications Solutions

Part No. 86832-458HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 58 Positions, 2.54 mm Pitch, Vertical, 8.26 mm (0.325 in.) Mating, 2.54 mm (0.1 in.) Tail.
Tech specs    

Official Product Page

    M13S128324A

Elite Semiconductor Memory Technology Inc.
Part No. M13S128324A
Description 1M x 32 Bit x 4 Banks Double Data Rate SDRAM

File Size 865.01K  /  49 Page

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Amphenol Communications Solutions

Part No. 86094328324785V1LF
Description DIN Headers & Receptacles, Backplane Connector, Standard Receptacle, Vertical, Through Hole, Style C/2, 32 ways, Mil - Class
Tech specs    

Official Product Page

For 74026-8324 Found Datasheets File :: 113+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 |   

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