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  435-1314-001 Datasheet PDF File

For 435-1314-001 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
Part No. FLM1314-8F
Description X, Ku-Band Internally Matched FET
File Size 292.61K  /  4 Page

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Amphenol Communications Solutions
Part No. 131-4114-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    EIC1314-7

Excelics Semiconductor, Inc.
Part No. EIC1314-7
Description 13.75-14.50 GHz 7-Watt Internally Matched Power FET
File Size 241.19K  /  4 Page

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Amphenol Communications Solutions
Part No. 131-4416-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    EIC1314-8

Excelics Semiconductor, Inc.
Part No. EIC1314-8
Description 13.75-14.5 GHz 8-Watt Internally Matched Power FET
File Size 164.78K  /  4 Page

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Amphenol Communications Solutions
Part No. 131-4118-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs 　 　

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    Excelics Semiconductor
Part No. EIA1314-4P
Description 13.75-14.5 GHz 4W Internally Matched Power FET
File Size 43.94K  /  1 Page

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Amphenol Communications Solutions
Part No. 131-4514-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Left Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs 　 　

Official Product Page

    EUDYNA[Eudyna Devices Inc]
Part No. FLM1314-8F
Description X, Ku-Band Internally Matched FET
File Size 297.61K  /  4 Page

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Amphenol Communications Solutions
Part No. 131-4216-21D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Double End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    TIM1314-9L

Toshiba Semiconductor
Part No. TIM1314-9L
Description IM3(Min.)=−25dBc at Po=33dBm Single Carrier Level
File Size 150.95K  /  4 Page

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Amphenol Communications Solutions
Part No. 131-4518-21D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Left Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    EIA1314-8P

Excelics Semiconductor, Inc.
Part No. EIA1314-8P
Description 13.75-14.5GHz, 8W Internally Matched Power FET
File Size 41.19K  /  1 Page

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Amphenol Communications Solutions
Part No. 131-4314-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Left End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs 　 　

Official Product Page

    EIM1314-5

Excelics Semiconductor, Inc.
Part No. EIM1314-5
Description 13.75-14.50GHz Multi-Stage Power Amplifier
File Size 208.72K  /  3 Page

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Amphenol Communications Solutions
Part No. 131-4616-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 2.25mm Wipe, APP.
Tech specs 　 　

Official Product Page

    Sony, Corp.
Part No. HV1314P
Description Interface IC 接口IC
File Size 139.39K  /  5 Page

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Amphenol Communications Solutions
Part No. 131-4316-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Left End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    2SB1314

List of Unclassifed Manufacturers
Mitsubishi Electric Corporation
ETC[ETC]
Isahaya Electronics Corporation
Electronic Theatre Controls, Inc.
Part No. 2SB1314
Description SMALL-SIGNAL TRANSISTOR FOR LOW FREQUENCY POWER AMPLIFY APPLICATION
File Size 119.32K  /  3 Page

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Amphenol Communications Solutions
Part No. 131-4618-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

For 435-1314-001 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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