43045-1811 pdf Datasheet P6 Part Num --- IC-ON-LINE


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43045-1811 Datasheet PDF File

For 43045-1811 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

					Molex Electronics Ltd.
Part No.	43045-2418
Description
File Size	175.78K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10093084-3045HFLF
Description	QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Molex Electronics Ltd.
Part No.	43045-2417
Description
File Size	174.08K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10093084-3045LF
Description	QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	43045-2416
Description
File Size	174.08K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-8118-11D
Description	Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	43045-2415
Description
File Size	174.05K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-8118-11H
Description	Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	43045-2414
Description
File Size	166.54K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10131318-18111G0LF
Description	Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 18 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	43045-2413
Description
File Size	166.55K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68418-112HLF
Description	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	43045-2412
Description
File Size	166.52K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77315-118-11LF
Description	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	43045-2411
Description
File Size	180.51K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77315-418-11LF
Description	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	43045-2420
Description
File Size	175.81K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-4218-11D
Description	Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	43045-1816
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Press-fit Metal Retention Clip, 18 Circuits
File Size	174.08K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-5618-11D
Description	Paladin® 112Gb/s Backplane Connector, 5-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs				Official Product Page

For 43045-1811 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

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