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  3164 Datasheet PDF File

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    Q62703-Q3142 Q62703-Q3143 LH_T676 Q62703-Q3164 LHT676 LHT676-NR LHT676-P LHT676-PS LHT676-Q LHT676-R Q62703-Q3140 Q62703

SIEMENS[Siemens Semiconductor Group]
SIEMENS AG
Part No. Q62703-Q3142 Q62703-Q3143 LH_T676 Q62703-Q3164 LHT676 LHT676-NR LHT676-P LHT676-PS LHT676-Q LHT676-R Q62703-Q3140 Q62703-Q3141
Description From old datasheet system
Hyper TOPLED Hyper-Bright Hyper-Red TS GaAIAs-LED
758886000
Hyper TOPLED Hyper-Bright, Hyper-Red TS GaAIAs-LED SINGLE COLOR LED, HYPER RED, 2.4 mm

File Size 312.45K  /  6 Page

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Amphenol Communications Solutions

Part No. 61083-164402LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    ZETEX[Zetex Semiconductors]
Part No. ZM33164_06 ZM33164 ZM33164C ZM33164G ZM3316406
Description SUPPLY VOLTAGE MONITOR

File Size 135.96K  /  5 Page

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Amphenol Communications Solutions

Part No. 131-6414-11D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    MOTOROLA INC
Part No. MC34164D-3R1 MC33164D-3R2 MC34164D-5R1 MC34164D-3R2
Description 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO8

File Size 193.88K  /  12 Page

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Amphenol Communications Solutions

Part No. 131-6418-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    T2316405A T2316405A-10 T2316405A-50 T2316405A-60 T2316405A-70 T2316407A T2316407A-10 T2316407A-50 T2316407A-60 T2316407A

Taiwan Memory Technolog...
TMT[Taiwan Memory Technology]
TM Technology, Inc.
Part No. T2316405A T2316405A-10 T2316405A-50 T2316405A-60 T2316405A-70 T2316407A T2316407A-10 T2316407A-50 T2316407A-60 T2316407A-70
Description 4M x 4 DYNAMIC RAM EDO PAGE MODE
SPST, Low Profile DIP Switches

File Size 134.00K  /  14 Page

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Amphenol Communications Solutions

Part No. 69133-164HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 64 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    MV54164 MV57164 MV53164

QT[QT Optoelectronics]
Part No. MV54164 MV57164 MV53164
Description BARGRAPH DISPLAYS

File Size 392.99K  /  4 Page

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Amphenol Communications Solutions

Part No. 61083-164429LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    FAIRCHILD[Fairchild Semiconductor]
Part No. MV53164 MV57164 MV54164
Description BARGRAPH DISPLAYS

File Size 414.84K  /  5 Page

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Amphenol Communications Solutions

Part No. 131-6418-11D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0015453164 15-45-3164 A-71395-1164

Molex Electronics Ltd.
Part No. 0015453164 15-45-3164 A-71395-1164
Description 2.54mm (.100) Pitch C-Grid? PCB Connector, Surface Mount, High Profile, Dual Row, Vertical, 64 Circuits

File Size 736.20K  /  6 Page

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Amphenol Communications Solutions

Part No. 77316-457LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single row , Polarized, 17 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    SIEMENS AG
Part No. HYB3164160T
Description 4M x 16-Bit Dynamic RAM 4米16位动态随机存储器

File Size 371.08K  /  26 Page

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Amphenol Communications Solutions

Part No. 131-6416-11D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    HYB3164405J-60

INFINEON TECHNOLOGIES AG
Part No. HYB3164405J-60
Description 16M X 4 EDO DRAM, 60 ns, PDSO34

File Size 606.32K  /  32 Page

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Amphenol Communications Solutions

Part No. 77316-448LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single row , Polarized, 3 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    Infineon Technologies A...
Part No. MA001043164
Description Material Content Data Sheet

File Size 19.16K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-6414-21H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Right End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

For 3164 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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