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Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor] Samsung Electronic
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Part No. |
MR18R326GAG0-CT9 MR18R326GAG0-CM8 MR18R326GAG0
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OCR Text |
...x 1.375" x 0.05")
banks on 1.1gb module
Note: On double sided modules, RDRAM devices are also installed on bottom side of PCB.
Figure 1: RIMM Module shown with heat spreader removed
Page 1
Version 1.0 Mar. 2004
MR18R326GAG... |
Description |
(32Mx18) 16pcs RIMM Module based on 576Mb A-die, 32s banks,32K/32ms Ref, 2.5V 2Mx186个RIMM的模块基76Mb阿芯片,32秒银行,32K/32ms参考,.5V (32Mx18) 16pcs RIMM Module based on 576Mb A-die 32s banks32K/32ms Ref 2.5V
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File Size |
256.70K /
14 Page |
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Price and Availability
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