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SAMSUNG SEMICONDUCTOR CO. LTD.
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Part No. |
KBE00S003M
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OCR Text |
...i-chip package memory 1g bit (128mx8) nand flash*2 / 256m bit (8mx8x4banks) mobile sdram*2
mcp memory 3 kbe00s003m-d411 revision 1.0 may 2005 general description features <common> ? operating temperature : -25 c ~ 85 c ? package :... |
Description |
1Gb NAND*2 256Mb Mobile SDRAM*2
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File Size |
1,819.19K /
86 Page |
View
it Online |
Download Datasheet
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SAMSUNG SEMICONDUCTOR CO. LTD.
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Part No. |
KBE00S009M-D411 KBE00S009M-D4110
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OCR Text |
...i-chip package memory 1g bit (128mx8) nand flash*2 / 256m bit (4mx16x4banks) mobile sdram*2
mcp memory 3 kbe00s009m-d411 revision 1.0 may 2005 general description features <common> ? operating temperature : -25 c ~ 85 c ? package ... |
Description |
1Gb NAND x 2 256Mb Mobile SDRAM x 2 SPECIALTY MEMORY CIRCUIT, PBGA137
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File Size |
1,908.72K /
86 Page |
View
it Online |
Download Datasheet
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![](images/bg04.gif) |
Samsung Electronic
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Part No. |
KBE00S003M KBE00S003M-D411
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OCR Text |
...i-chip package memory 1g bit (128mx8) nand flash*2 / 256m bit (8mx8x4banks) mobile sdram*2
mcp memory 3 kbe00s003m-d411 revision 1.0 may 2005 general description features <common> ? operating temperature : -25 c ~ 85 c ? package :... |
Description |
1Gb NAND*2 256Mb Mobile SDRAM*2
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File Size |
1,809.86K /
86 Page |
View
it Online |
Download Datasheet
|
|
|
![](images/bg04.gif) |
Samsung Electronic
|
Part No. |
KBE00S009M-D411
|
OCR Text |
...i-chip package memory 1g bit (128mx8) nand flash*2 / 256m bit (4mx16x4banks) mobile sdram*2
mcp memory 3 kbe00s009m-d411 revision 1.0 may 2005 general description features <common> ? operating temperature : -25 c ~ 85 c ? package ... |
Description |
1Gb NAND x 2 256Mb Mobile SDRAM x 2
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File Size |
1,899.39K /
86 Page |
View
it Online |
Download Datasheet
|
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Price and Availability
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