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tack Datasheet PDF File

For tack Found Datasheets File :: 168 Search Time::1.813ms
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				List of Unclassifed Manufacturers ETC[ETC] Electronic Theatre Controls, Inc.
Part No.	QL4009-4PL68M QL4009 QL4009-0PF100C QL4009-0PF100I QL4009-0PF100M QL4009-0PF84C QL4009-0PF84I QL4009-0PF84M QL4009-0PL68C QL4009-0PL68I QL4009-0PL68M QL4009-1PF100C QL4009-1PF100I QL4009-1PF100M QL4009-1PF84C QL4009-1PF84I QL4009-1PF84M QL4009-1PL68C QL4009-1PL68I QL4009-1PL68M QL4009-2PF100C QL4009-2PF100I QL4009-2PF100M QL4009-2PF84C QL4009-2PF84I QL4009-2PF84M QL4009-2PL68C QL4009-2PL68I QL4009-2PL68M QL4009-3PF100C QL4009-3PF100I QL4009-3PF100M QL4009-3PF84C QL4009-3PF84I QL4009-3PF84M QL4009-3PL68C QL4009-3PL68I QL4009-3PL68M QL4009-4PF100C QL4009-4PF100I QL4009-4PF100M QL4009-4PF84C QL4009-4PF84I QL4009-4PF84M QL4009-4PL68C QL4009-4PL68I
OCR Text	... Clock Cells Symbol Parameter 1 tack tGCKP tGCKB Array Clock Delay Global Clock Pin Delay Global Clock Buffer Delay Propagation Delays (ns) Fanouta 2 3 4 8 10 11 1.2 1.2 1.3 1.3 1.5 1.6 1.7 0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.8 0.8 0.9 0.9 1.1...
Description	2.2 UF CERAMIC CAPACITOR 9,000 Usable PLD Gate QuickRAM ESP Combining Performance, Density and Embedded RAM 9000可用可编程逻辑门QuickRAM ESP结合性能，密度和嵌入式内 CAP, 4.7UF /- 20% 25V 9000可用可编程逻辑门QuickRAM ESP结合性能，密度和嵌入式内
File Size	173.72K / 18 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers ETC[ETC] Electronic Theatre Controls, Inc.
Part No.	QL4016-4PLM QL4016 QL4016-0CF100C QL4016-0CF100I QL4016-0CF100M QL4016-0PF100C QL4016-0PF100I QL4016-0PF100M QL4016-0PF144C QL4016-0PF144I QL4016-0PF144M QL4016-0PL84C QL4016-0PL84I QL4016-0PL84M QL4016-0PLC QL4016-0PLI QL4016-0PLM QL4016-1CF100C QL4016-1CF100I QL4016-1CF100M QL4016-1PF100C QL4016-1PF100I QL4016-1PF100M QL4016-1PF144C QL4016-1PF144I QL4016-1PF144M QL4016-1PL84C QL4016-1PL84I QL4016-1PL84M QL4016-1PLC QL4016-1PLI QL4016-1PLM QL4016-2CF100C QL4016-2CF100I QL4016-2CF100M QL4016-2PF100C QL4016-2PF100I QL4016-2PF100M QL4016-2PF144C QL4016-2PF144I QL4016-2PF144M QL4016-2PL84C QL4016-2PL84I QL4016-2PL84M QL4016-2PLC QL4016-2PLI QL4016-2PLM QL4016-3CF100C QL4016-3CF100I QL4016-3CF100M QL4016-3PF100C QL4016-3PF100I QL4016-3PF100M QL4016-3PF144C QL4016-3PF144I QL4016-3PF144M QL4016-3PL84C QL4016-3PL84I QL4016-3PL84M QL4016-3PLC QL4016-3PLI QL4016-3PLM QL4016-4CF100C QL4016-4CF100I QL4016-4CF100M QL4016-4PF100C QL4016-4PF100I QL4016-4PF100M QL4016-4PF144C QL4016-4PF144I QL4016-4PF144M QL4016-4PL84C QL4016-4PL84I QL4016-4PL84M QL4016-4PLC QL4016-4PLI
OCR Text	... Clock Cells Symbol Parameter 1 tack tGCKP tGCKB Array Clock Delay Global Clock Pin Delay Global Clock Buffer Delay Propagation Delays (ns) Fanouta 2 3 4 8 10 11 1.2 1.2 1.3 1.3 1.5 1.6 1.7 0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.8 0.8 0.9 0.9 1.1...
Description	16/000 Usable PLD Gate QuickRAM ESP Combining Performance/ Density and Embedded RAM GT 19C 19#16 SKT RECP Circular Connector; MIL SPEC:MIL-C-5015; Body Material:Metal; Series:GT; No. of Contacts:19; Connector Shell Size:22; Connecting Termination:Crimp; Circular Shell Style:Square Flange Receptacle; Body Style:Straight GT 4C 4#16 SKT RECP 16,000 Usable PLD Gate QuickRAM ESP Combining Performance, Density and Embedded RAM 16000可用门QuickRAM ESP PLD的结合性能，密度和嵌入式内
File Size	175.08K / 18 Page	View it Online	Download Datasheet

				EXAR[Exar Corporation]
Part No.	XRT83SL38IV XRT83SL38 XRT83SL38IB
OCR Text	...LE_AS / EQC 2 CS / EQC 3 R DY_D tack / EQC 4 TAO S_0 TAO S_1 TAO S_2 TAO S_3 DMO _0 TN EG_1 / CO DES_1 TPOS_1 / TD ATA_1 TCLK_1 TCLK_0 TPOS_0 / TD ATA_0 TN EG_0 / CO DES_0 R LO S_0 R CLK_0 R N EG_0 / LC V_0 157 158 159 160 161 162 163 16...
Description	From old datasheet system OCTAL T1/E1/J1 SH TRANSCEIVER WITH CLOCK RECOVERY AND JITTER ATTENUATOR
File Size	548.57K / 89 Page	View it Online	Download Datasheet

				ST Microelectronics, Inc. STMicroelectronics
Part No.	EMIF03-SIM02M8
OCR Text	...e is recommended. Offers a high tack force to resist component movement during high speed Solder paste with fine particles: powder particle size is 20-45 m. 7/10 Recommendation on PCB assembly EMIF03-SIM02M8 5.3 Placement 1....
Description	3-line EMI filter and ESD protection for SIM card interfaces EMI Filtering & Signal Conditioning 3 line IPAD, EMI filter for SIM card applications
File Size	358.93K / 10 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	EMIF02-1003M6
OCR Text	...e is recommended. Offers a high tack force to resist component movement during high speed Solder paste with fine particles: powder particle size is 20-45 m. 7/10 Recommendation on PCB assembly EMIF02-1003M6 5.3 Placement 1. ...
Description	2 line IPAD? EMI filter and ESD protection in Micro QFN package 2 line IPAD⑩, EMI filter and ESD protection in Micro QFN package
File Size	178.73K / 10 Page	View it Online	Download Datasheet

				Tyco Electronics
Part No.	2-1416001-0 1-1416001-4 V23072-A1061-A303 V23072-A1061-A308 V23072-A1062-A303 V23072-A1062-A308 V23072-C1061-A302 V23072-C1061-A303 V23072-C1061-A308 V23072-C1061-A402 V23072-C1061-A408 V23072-C1062-A302 V23072-C1062-A303 V23072-C1062-A308 3-1393272-2 5-1393272-2 5-1393272-3 3-1393272-6 5-1393273-0 6-1393273-0 8-1393273-2 7-1393273-6 7-1393273-8 4-1393273-9
OCR Text	...n and/or higher risk of contact tack welding. Operating voltage range Does not take into account the temperature rise due to the contact current E = pre-energization Mechanical data Enclosure Sealed Sealed relay is suitable for im...
Description	PCB relays Single relays Mini power relay K (open and sealed)
File Size	251.96K / 6 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	USBULC6-2M6
OCR Text	...e is recommended. Offers a high tack force to resist component movement during high speed Solder paste with fine particles: powder particle size is 20-45 m. 7/10 Recommendation on PCB assembly USBULC6-2M6 5.3 Placement 1. 2....
Description	Ultra large bandwidth ESD protection
File Size	322.27K / 10 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	EMIF04-1502M8
OCR Text	...e is recommended. Offers a high tack force to resist component movement during high speed Solder paste with fine particles: powder particle size is 20-45 m. 4.3 Placement 1. 2. 3. 4. Manual positioning is not recommended. It is recom...
Description	4-line IPAD low capacitance EMI filter and ESD protection in micro QFN package 4-line IPAD⑩ low capacitance EMI filter and ESD protection in micro QFN package
File Size	177.65K / 10 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	EMIF06-1502M12 EMIF06-1502M1208
OCR Text	...e is recommended. Offers a high tack force to resist component movement during high speed Solder paste with fine particles: powder particle size is 20-45 m. 4.3 Placement 1. 2. 3. 4. Manual positioning is not recommended. It is recom...
Description	6-line IPAD?/a> low capacitance EMI filter and ESD protection in micro QFN package 6-line IPAD⑩ low capacitance EMI filter and ESD protection in micro QFN package
File Size	174.23K / 10 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	EMIF08-1502M16
OCR Text	...e is recommended. Offers a high tack force to resist component movement during high speed Solder paste with fine particles: powder particle size is 20-45 m. 4.3 Placement 1. 2. 3. 4. Manual positioning is not recommended. It is recom...
Description	8-line IPAD low capacitance EMI filter and ESD protection in micro QFN package 8-line IPAD⑩ low capacitance EMI filter and ESD protection in micro QFN package
File Size	175.46K / 10 Page	View it Online	Download Datasheet

For tack Found Datasheets File :: 168 Search Time::1.813ms
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