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For rework Found Datasheets File :: 1315 Search Time::1.343ms
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				Fairchild Semiconductor
Part No.	FMPA2300
OCR Text	... and be a consistent thickness. rework Considerations: rework of a device attached to a board is limited to reflow of the solder with a heat gun. The device should be subjected to no more than 15C above the solder melting temperature for no...
Description	2.3-2.4GHz WiMax/WiBro Linear Power Amplifier
File Size	531.56K / 9 Page	View it Online	Download Datasheet


Part No.	GO1525
OCR Text	...o applies to solder paste. 3.4 rework or Repair rework or repair must only be done once. Do not reflow the device more than twice; once for initial soldering and once for remounting after rework. Do not vibrate the VCO during reflow sol...
Description	VCO for GS1560A/61/32. GS9060/62. GS7060/62 VCOforGS1560A/61/32.GS9060/62.GS7060/62
File Size	376.90K / 4 Page	View it Online	Download Datasheet

				Fairchild Semiconductor
Part No.	RMPA1965
OCR Text	... and be a consistent thickness. rework Considerations: rework of a device attached to a board is limited to reflow of the solder with a heat gun. The device should not be subjected to more than 225C and reflow solder in the molten state for...
Description	PCS 3.4V CDMA and CDMA2000-1X Power Amplifier Module
File Size	508.77K / 8 Page	View it Online	Download Datasheet

				Gennum Corporation
Part No.	GO1555
OCR Text	.............................6 3.3 rework or Repair ............................................................................................6 3.4 Endurance To Warp ..............................................................................
Description	Voltage Controlled Oscillator
File Size	190.67K / 12 Page	View it Online	Download Datasheet

				Fairchild Semiconductor
Part No.	RMPA1963
OCR Text	...nd be a consistent thickness. * rework Considerations: rework of a device attached to a board is limited to reflow of the solder with a heat gun. The device should not be subjected to more than 225C and reflow solder in the molten state for...
Description	US-PCS CDMA and CDMA2000-1X Power Amplifier Module
File Size	529.20K / 7 Page	View it Online	Download Datasheet

				Fairchild Semiconductor
Part No.	RMPA0967
OCR Text	... and be a consistent thickness. rework Considerations: rework of a device attached to a board is limited to reflow of the solder with a heat gun. The device should not be subjected to more than 225C and reflow solder in the molten state for...
Description	CDMA and CDMA2000-1X Power Amplifier Module
File Size	528.56K / 8 Page	View it Online	Download Datasheet

				Fairchild Semiconductor
Part No.	RMPA0965
OCR Text	... and be a consistent thickness. rework Considerations: rework of a device attached to a board is limited to reflow of the solder with a heat gun. The device should not be subjected to more than 225C and reflow solder in the molten state for...
Description	CDMA and CDMA2000-1X Power Amplifier Module
File Size	531.97K / 8 Page	View it Online	Download Datasheet

				Fairchild Semiconductor
Part No.	RMPA0963
OCR Text	...nd be a consistent thickness. * rework Considerations: rework of a device attached to a board is limited to reflow of the solder with a heat gun. The device should not be subjected to more than 225C and reflow solder in the molten state for...
Description	Cellular CDMA and CDMA2000-1X Power Amplifier Module
File Size	527.71K / 7 Page	View it Online	Download Datasheet

				SGS Thomson Microelectronics
Part No.	AN1553
OCR Text	... - APPLICATION NOTE 4.4 Manual rework Flip-Chip CSPs are able to tolerate one repair in addition to the two reflows mentioned in section 4.2. As for other BGA type packages, the use of laser systems is the most suitable form for Flip-Chip ...
Description	FLIP CHIP 300MICRONSM RECOMMENDATIONS FOR AUDIO POWER AMPLIFIER
File Size	68.17K / 6 Page	View it Online	Download Datasheet

				SGS Thomson Microelectronics
Part No.	AN1547
OCR Text	... - APPLICATION NOTE 4.4 Manual rework Flip-Chip CSPs are able to tolerate one repair in addition to the two reflows mentioned in section 4.2. As for other BGA type packages, the use of laser systems is the most suitable form for Flip-Chip ...
Description	FLIP CHIP 170MICRONSM RECOMMENDATIONS FOR AUDIO POWER AMPLIFIERS
File Size	68.82K / 6 Page	View it Online	Download Datasheet

For rework Found Datasheets File :: 1315 Search Time::1.343ms
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