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  hot-carrier Datasheet PDF File

For hot-carrier Found Datasheets File :: 1041    Search Time::2.828ms    
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    ONSEMI[ON Semiconductor]
Part No. MMDL301T1 MMDL301 MMDL301T1-D
OCR Text hot-carrier Diodes Schottky Barrier Diode These devices are designed primarily for high-efficiency UHF and VHF detector applications. They are readily adaptable to many other fast switching RF and digital applications. They are supplied i...
Description Silicon hot-carrier Diodes Schottky Barrier Diode

File Size 39.82K  /  4 Page

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    ON Semi
Part No. MMDL301T1 ON2209
OCR Text hot-carrier Diodes Schottky Barrier Diode These devices are designed primarily for high-efficiency UHF and VHF detector applications. They are readily adaptable to many other fast switching RF and digital applications. They are supplied i...
Description Schottky Barrier Diode
From old datasheet system

File Size 73.06K  /  4 Page

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    MMDL301T1

LRC[Leshan Radio Company]
Part No. MMDL301T1
OCR Text hot-carrier Diodes Schottky Barrier Diode MMDL301T1 These devices are designed primarily for high-efficiency UHF and VHF detector applications. They are readily adaptable to many other fast switching RF and digital applications. They a...
Description Silicon hot-carrier Diodes

File Size 114.64K  /  3 Page

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    ON Semi
Part No. MMBD452LT1 ON2081
OCR Text hot-carrier Diodes Schottky Barrier Diodes These devices are designed primarily for high-efficiency UHF and VHF detector applications. They are readily adaptable to many other fast switching RF and digital applications. They are supplied ...
Description DUAL HOT CARRLER MIXER DLODES Schottky Barrier Diodes
From old datasheet system

File Size 94.82K  /  4 Page

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    http://
HIROSE[Hirose Electric]
Hirose Electric USA, INC.
HIROSE ELECTRIC Co., Ltd.
Part No. FH26-71S-0.3SHW FH26-13S-0.3SHW FH26-21S-0.3SHW FH26-23S-0.3SHW FH26-25S-0.3SHW FH26-27S-0.3SHW FH26-33S-0.3SHW FH26-35S-0.3SHW FH26-39S-0.3SHW FH26-41S-0.3SHW FH26-45S-0.3SHW FH26-51S-0.3SHW FH26-57S-0.3SHW
OCR Text ...tions Solder method :Reflow, IR/hot air (Nihon Den-netsu Co., Ltd.'s Part Number: SENSBY NR-2) Environment: :Room air Solder composition: :Paste, 63%Sn/37%Pb (Senju Metal Industry, Co., Ltd.'s Part Number: OZ63-201C-50-9) Test board :Glass ...
Description 0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors 0.3毫米间距联系,高于板,柔性线路板连接mm的中
0.3mm Contact Pitch/ 1mm above the board/ Flexible Printed Circuit ZIF Connectors
   0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors

File Size 648.71K  /  16 Page

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    ONSEMI[ON Semiconductor]
Part No. MMBD452LT1 MMBD452L MMBD452LT1-D
OCR Text hot-carrier Diodes Schottky Barrier Diodes These devices are designed primarily for high-efficiency UHF and VHF detector applications. They are readily adaptable to many other fast switching RF and digital applications. They are supplied ...
Description Dual hot-carrier Diodes Schottky Barrier Diodes
DUAL hot-carrier DETECTOR AND SWITCHING DIODES

File Size 41.50K  /  4 Page

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    MIC-5401 MIC-5401-0000E

Advantech Co., Ltd.
http://
Part No. MIC-5401 MIC-5401-0000E
OCR Text Hot-swap capable Advanced Mezzanine Card SAS/SATA Storage AMC Single-width mid-size AMC form factor SAS or SATA 2.5" hard disk drive...Carrier Management Controller on an ATCA platform, or to the MicroTCA Carrier Management Controller ...
Description Advanced Mezzanine Card SAS/SATA Storage AMCRoHSCOMPLIANT2002/95/EC

File Size 198.95K  /  2 Page

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    MADP-000165-01340W MADP-000135-01340W MA4P203-134 MA4P161-134

M/A-COM Technology Solutions, Inc.
Part No. MADP-000165-01340W MADP-000135-01340W MA4P203-134 MA4P161-134
OCR Text .... Eutectic Die Attachment Using Hot Gas Die Bonder: A work surface temperature of 255oC is recommended. When hot forming gas (95%N/5%H) is applied, the work area temperature should be approximately 290oC. The chip should not be exposed to t...
Description Silicon PIN Chips

File Size 384.77K  /  6 Page

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    ASMT-MAK0-AGH00

AVAGO TECHNOLOGIES LIMITED
AVAGO TECHNOLOGIES LIMI...
Part No. ASMT-MAK0-AGH00
OCR Text ...ction/wetting forces of the hot liquid solder. pc board traces should connect to the center of each attach - ment pad. traces that c...carrier tape. a hole is located in the bottom of each embossed cavity to allow an au...
Description Surface Mounting SMT LED Indicator Components

File Size 115.45K  /  6 Page

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    MA4GP030-277 MA4GP022-277 MA4GP030

M/A-COM Technology Solutions, Inc.
Part No. MA4GP030-277 MA4GP022-277 MA4GP030
OCR Text .... Eutectic Die Attachment Using Hot Gas Die Bonder: A work surface temperature of 255oC is recommended. When hot forming gas is applied, the work area temperature should be approximately 290oC. The chip should not be exposed to temperatures...
Description GaAs PIN Diode Chips

File Size 329.55K  /  6 Page

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For hot-carrier Found Datasheets File :: 1041    Search Time::2.828ms    
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