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CYPRESS
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Part No. |
CY7C1440V3
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OCR Text |
...le in 119-ball bump BG,165-ball FBGA package, and 100-pin TQFP packages (CY7C1440V33 and CY7C1442V33). 209 FBGA package for CY7C1446V33. Chi...73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
DQPb NC NC DQb NC DQb VDDQ V... |
Description |
1M X 36/2M X 18/512K X 72 Pipelined SRAM
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File Size |
992.68K /
31 Page |
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it Online |
Download Datasheet |
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Samsung Electronic SAMSUNG[Samsung semiconductor] SAMSUNG SEMICONDUCTOR CO. LTD. ITT, Corp.
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Part No. |
K7B161825A K7A163600A K7A163601A K7B163625A K7A161800A K7A161801A K7A203200B-QCI14
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OCR Text |
...2. Correct the Ball Size of 165 FBGA. 1. Delete x32 Org. 2. Delete 165FBGA package. 3. Delelte the 6.5 ns speed bin. Draft Date Feb. 23. 200...73,74,75,78,79 2,3,6,7,8,9,12,13 18,19,22,23,24,25,28,29 51,80,1,30 32,33,34,35,36,37,42 43,44,45,46... |
Description |
512Kx36 & 1Mx18 Synchronous SRAM 64Kx36 & 64Kx32-Bit Synchronous Pipelined Burst SRAM Aluminum Snap-In Capacitor; Capacitance: 390uF; Voltage: 400V; Case Size: 35x30 mm; Packaging: Bulk Aluminum Snap-In Capacitor; Capacitance: 470uF; Voltage: 250V; Case Size: 25x30 mm; Packaging: Bulk 512Kx36
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File Size |
264.02K /
19 Page |
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it Online |
Download Datasheet |
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Price and Availability
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