|
|
 |
Integrated Device Techn...
|
Part No. |
8S89832AKILF 8S89832AKILFT 8S89832I
|
OCR Text |
...e package corresponding to the exposed metal pad or exposed heat slug on the package, as shown in figure 3. the solderable area on the pcb, as defined by the solder mask, should be at least the same size/shape as the exposed pad/slug ... |
Description |
Low Skew, 1-to-4 Differential-to-LVDS Fanout Buffer
|
File Size |
289.93K /
16 Page |
View
it Online |
Download Datasheet
|
|
|
 |
Integrated Device Techn...
|
Part No. |
8S89832AKILFT 8S89832I 8S89832I-17
|
OCR Text |
...e package corresponding to the exposed metal pad or exposed heat slug on the package, as shown in figure 3. the solderable area on the pcb, as defined by the solder mask, should be at least the same size/shape as the exposed pad/slug ... |
Description |
Low Skew, 1-to-4 Different ial-to-LVDS Fanout Buffer
|
File Size |
311.98K /
14 Page |
View
it Online |
Download Datasheet
|
|

Price and Availability
|