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  CTVP14F-1611 Datasheet PDF File

For CTVP14F-1611 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    2SA1611

Guangdong Kexin Industrial Co.,Ltd
Part No. 2SA1611
Description PNP Silicon Epitaxia

File Size 43.92K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-6116-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

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HUA FENG CIRCUIT





    2SD1611

Guangdong Kexin Industrial Co.,Ltd
Part No. 2SD1611
Description Silicon NPN Triple Diffusion Planar Type Darlington

File Size 39.63K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-6116-11D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

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    2SA1611

SeCoS Halbleitertechnologie GmbH
Part No. 2SA1611
Description PNP Silicon Plastic Encapsulated Transistor

File Size 105.89K  /  1 Page

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Amphenol Communications Solutions

Part No. 20021611-00012T1LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 12 contacts
Tech specs    

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    Shenzhen Jin Yu Semiconductor Co., Ltd.
Part No. 2SA1611
Description TRANSISTOR(PNP)

File Size 273.97K  /  1 Page

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Amphenol Communications Solutions

Part No. 20021611-00030T1LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 30 contacts
Tech specs    

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Part No. 23C1611
Description From old datasheet system

File Size 104.08K  /  7 Page

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Amphenol Communications Solutions

Part No. 87916-113HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 13 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
Tech specs    

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Part No. 23L1611
Description From old datasheet system

File Size 57.01K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021611-00040T8LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 40 contacts
Tech specs    

Official Product Page

   
Part No. 29L1611
Description From old datasheet system

File Size 208.82K  /  36 Page

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Amphenol Communications Solutions

Part No. 87916-111HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 11 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
Tech specs    

Official Product Page

    Panasonic
Part No. 2SD1611
Description Power Device - Power Transistors - General-Purpose power amplification

File Size 84.57K  /  4 Page

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Amphenol Communications Solutions

Part No. 20021611-00008T1LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 8 contacts
Tech specs    

Official Product Page

    Samsung Semiconductor Co., Ltd.
Part No. KS16116-02
Description 9600 bps FAX MODEM(9600bps传真调制解调 9600 bps的传真调制解调器9600bps的传真调制解调器

File Size 25.32K  /  3 Page

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Amphenol Communications Solutions

Part No. U90H161100A
Description ExpressPort QSFP+, High Speed Input Output Connectors, QSFP 12.73MM HS 1X1.
Tech specs    

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    Samsung Semiconductor Co., Ltd.
Part No. KS16118
Description 9600bps FAX super one-chip(9600bps传真调制解调 9600bps传真超级单芯片(9600bps传真调制解调器)

File Size 27.07K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-3516-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

For CTVP14F-1611 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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