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Molex Electronics Ltd.
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| Part No. |
5566-03B3-210 39-30-2036
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| Description |
4.20mm (.165) Pitch Mini-Fit Jr.?/a> Header, Single Row, Vertical, with Snap-in Plastic Peg PCB Lock, 3 Circuits, PA Polyamide Nylon 6/6, UL 94V-0, Tin (Sn) Plating, with Drain Holes
4.20mm (.165) Pitch Mini-Fit Jr. Header, Single Row, Vertical, with Snap-in Plastic Peg PCB Lock, 3 Circuits, PA Polyamide Nylon 6/6, UL 94V-0, Tin (Sn) Plating, with Drain Holes
4.20mm (.165") Pitch Mini-Fit Jr.垄芒 Header, Single Row, Vertical, with Snap-in Plastic Peg PCB Lock, 3 Circuits, PA Polyamide Nylon 6/6, UL 94V-0, Tin (Sn) Plat
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| File Size |
129.57K /
3 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
95278-501-30LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-501-34LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-501-38LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-501-36LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-501-32LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
67292-036LF
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| Description |
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 72 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61083-203600LF
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| Description |
BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61083-203609LF
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| Description |
BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77311-820-36LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61083-203602LF
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| Description |
BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
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Official Product Page
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Price and Availability
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