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SD4502 A0B41Z ST6215 2SC5088 ACT57 P0902S 4AC13 MP86FS
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  66193-011 Datasheet PDF File

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    JST
Part No. RA-3011
Description Header, Cable Mount

File Size 98.08K  /  2 Page

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HUA FENG CIRCUIT





    2011-B

3M Electronics
Part No. 2011-B
Description Scotch-Brite High Performance

File Size 101.73K  /  4 Page

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    Molex, Inc.
Part No. 08-50-0113
Description Crimp Socket Contact; Wire Size (AWG):30-22; Contact Plating:Tin; Series:2759; Lead Pitch:2.54mm; Reel Quantity:10000; Voltage Rating:250V BRASS, TIN OVER NICKEL FINISH, WIRE TERMINAL

File Size 144.65K  /  2 Page

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    22-28-0111

Molex Electronics Ltd.
Part No. 22-28-0111
Description 2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, with Friction Lock, 11 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 55.32K  /  5 Page

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    90-0119

Maxim Integrated Products
Part No. 90-0119
Description PACKAGE LAND PATTERN, (U14E-3 / U14E 3)

File Size 20.18K  /  1 Page

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    21-0110

Dallas Semiconducotr
DALLAS[Dallas Semiconductor]
Part No. 21-0110
Description PACKAGE OUTLINE, 32L TQFP, 5x5x1.0mm

File Size 50.78K  /  2 Page

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    90-0117

Maxim Integrated Products
Part No. 90-0117
Description PACKAGE LAND PATTERN, (U16) 4.4MM TSSOP, 16 LEADS

File Size 15.55K  /  1 Page

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    MULTI CONTACT AG
Part No. 23.1011-23
Description INTERCONNECTION DEVICE

File Size 163.40K  /  2 Page

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    90-0112

Maxim Integrated Products
Part No. 90-0112
Description PACKAGE LAND PATTERN, 9S14) .150 SOIC 14 LEADS

File Size 23.31K  /  1 Page

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    03-09-2011

Molex Electronics Ltd.
Part No. 03-09-2011
Description THIS HOUSING IS FOR USE WITH THE .093 DIA. TERMININALS

File Size 34.12K  /  1 Page

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