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  3742 Datasheet PDF File

For 3742 Found Datasheets File :: 115+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 |   

    Toshiba Corporation
Part No. TIM3742-30SL-341
Description MICROWAVE POWER GaAs FET

File Size 136.41K  /  4 Page

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Amphenol Communications Solutions

Part No. L17DM537425
Description Dsub, Straight, Shielded Coax Contact, Socket, 0.38m(15 in) Gold Signal Pin, Flash Gold Shield, Cable 58 C/U, 50Ohm, Inner Soldercup/ Crimp Ferrule
Tech specs    

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HUA FENG CIRCUIT





    TIM3742-16SL-341

Toshiba Semiconductor
Part No. TIM3742-16SL-341
Description MICROWAVE POWER GaAs FET

File Size 69.40K  /  4 Page

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Amphenol Communications Solutions

Part No. 86837-422HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 22 Positions, 2.54 mm Pitch, Vertical, 9.65 mm (0.38 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    TIM3742-45SL-341

Toshiba Semiconductor
Part No. TIM3742-45SL-341
Description MICROWAVE POWER GaAs FET

File Size 500.68K  /  4 Page

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Amphenol Communications Solutions

Part No. L17DM53742
Description Dsub, Straight, Shielded Coax Contact, Socket, 0.38m(15 in) Gold Signal Pin, Flash Gold Shield, Cable 178 B/U, 50Ohm, Inner Soldercup/ Crimp Ferrule
Tech specs    

Official Product Page

    TOSHIBA[Toshiba Semiconductor]
Part No. TIM3742-30SL-341 TIM3742
Description MICROWAVE POWER GaAs FET
From old datasheet system

File Size 134.91K  /  4 Page

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Amphenol Communications Solutions

Part No. 86837-420HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 20 Positions, 2.54 mm Pitch, Vertical, 9.65 mm (0.38 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    Inchange Semiconductor ...
Part No. I2SK3742
Description    isc N-Channel MOSFET Transistor

File Size 326.87K  /  2 Page

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Amphenol Communications Solutions

Part No. L17DM537423
Description Dsub, Straight, Shielded Coax Contact, Socket, 0.38m(15 in) Gold Signal Pin, Flash Gold Shield, Cable 180 B/U, 50Ohm, Inner Soldercup/ Crimp Ferrule
Tech specs    

Official Product Page

    Freescale Semiconductor
Part No. MCZ33742
Description System Basis Chip

File Size 1,225.31K  /  65 Page

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Amphenol Communications Solutions

Part No. 86837-426HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 26 Positions, 2.54 mm Pitch, Vertical, 9.65 mm (0.38 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    Epson
Part No. S1D13742
Description Mobile Graphics Engine

File Size 1,229.30K  /  132 Page

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Amphenol Communications Solutions

Part No. 86837-428HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 28 Positions, 2.54 mm Pitch, Vertical, 9.65 mm (0.38 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

   
Part No. C403742A
Description From old datasheet system

File Size 98.33K  /  2 Page

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Amphenol Communications Solutions

Part No. L17DM537425001
Description Dsub, Straight, Shielded Coax Contact, Socket, 0.38m(15 in) Gold Signal Pin, Flash Gold Shield, Cable 179 B/U 316 B/U, 50Ohm, Inner Soldercup/ Ferrule
Tech specs    

Official Product Page

    Mitsubishi
Part No. M37428M4
Description Single-Chip 8-bit Microcontroller

File Size 4,242.42K  /  49 Page

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Amphenol Communications Solutions

Part No. 86837-424HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 24 Positions, 2.54 mm Pitch, Vertical, 9.65 mm (0.38 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

   
Part No. C423742A
Description From old datasheet system

File Size 107.95K  /  2 Page

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Amphenol Communications Solutions

Part No. DM537425006NCLF
Description DSUB COAX CONTACT-842-CF-215-1313
Tech specs    

Official Product Page

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