| |
|
 |
MACOM[Tyco Electronics]
|
| Part No. |
MAAPGM0029-DIE
|
| OCR Text |
...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply... |
| Description |
Amplifier, Power, 1W 3.5-6.5 GHz
|
| File Size |
209.59K /
5 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
MACOM[Tyco Electronics]
|
| Part No. |
MAAPGM0027-DIE
|
| OCR Text |
...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply ne... |
| Description |
2.0-4.0 GHz 1W Power Amplifier
|
| File Size |
270.40K /
6 Page |
View
it Online |
Download Datasheet |
| |
|
|
MACOM[Tyco Electronics]
|
| Part No. |
MAAPGM0026-DIE
|
| OCR Text |
...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply... |
| Description |
Amplifier, Power, 0.6W 1.5-3.3 GHz
|
| File Size |
183.22K /
5 Page |
View
it Online |
Download Datasheet |
| |
|
|
MACOM[Tyco Electronics]
|
| Part No. |
MAAPGM0021-DIE
|
| OCR Text |
...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply ne... |
| Description |
2W C/X-Band Power Amplifier 4.5-9.0 GHz
|
| File Size |
400.80K /
6 Page |
View
it Online |
Download Datasheet |
| |
|
|
MACOM[Tyco Electronics]
|
| Part No. |
MAAPGM0018-DIE
|
| OCR Text |
...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply ne... |
| Description |
2W Ku-Band Power Amplifier 12.0-15.5 GHz
|
| File Size |
327.09K /
6 Page |
View
it Online |
Download Datasheet |
| |
|
|
MACOM[Tyco Electronics]
|
| Part No. |
MAAPGM0016-DIE
|
| OCR Text |
...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply ne... |
| Description |
5W Ku-Band Power Amplifier 12.0-15.0 GHz
|
| File Size |
262.83K /
5 Page |
View
it Online |
Download Datasheet |
| |
|
|
MACOM[Tyco Electronics]
|
| Part No. |
MAAMGM0007-DIE
|
| OCR Text |
...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable.
Specifications subject t... |
| Description |
2.0-18.0 GHz Distributed Amp/Gain Block
|
| File Size |
315.57K /
6 Page |
View
it Online |
Download Datasheet |
| |
|
|
HITTITE[Hittite Microwave Corporation]
|
| Part No. |
HMC282
|
| OCR Text |
...025 mm (1 mil) diameter ball or wedge bonds are acceptable for DC bias connections. RF bypass capacitor should be used on the Vdd & Vgg inputs. 100 pF single layer capacitors (mounted eutectically or by conductive epoxy) placed no further t... |
| Description |
GaAs MMIC LOW NOISE AMPLIFIER 36 - 40 GHz
|
| File Size |
108.21K /
6 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
|
