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HMC647 UPA1916 1755842 CRA04S MGN1C SML60B25 TN8D41A 1N415
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  pencil Datasheet PDF File

For pencil Found Datasheets File :: 119    Search Time::1.375ms    
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    GC5007TWUNPRNP-V00CWNX GC5007SWUNPRNP-V00CWNX GC5007HWUNPRNP-V00CWNX GC5007SYDMNRNP-V00CWNX GC5007HWDMNRNP-V00CWNX GC500

Jewel Hill Electronic
Part No. GC5007TWUNPRNP-V00CWNX GC5007SWUNPRNP-V00CWNX GC5007HWUNPRNP-V00CWNX GC5007SYDMNRNP-V00CWNX GC5007HWDMNRNP-V00CWNX GC5007HWDMPRNP-V00CWNX GC5007HYUNNRNP-V00CWNX GC5007HYUNPRNP-V00CWNX GC5007SWDMNRNP-V00CWNX GC5007SWDMPRNP-V00CWNX GC5007TYDMNRNP-V00CWNX GC5007TWDMNRNP-V00CWNX GC5007TWDMPRNP-V00CWNX GC5007HYDMNRNP-V00CWNX GC5007HYDMPRNP-V00CWNX GC5007HWUMNRNP-V00CWNX GC5007SWDNNRNP-V00CWNX GC5007SWDNPRNP-V00CWNX
OCR Text ... with anything harder than a HB pencil lead (glass, tweezers, etc). (3) N-hexane is recommended for cleaning the adhesives used to attach front/rear polarizers and reflectors made of organic substances, which will be damaged by chemicals su...
Description SPECIFICATIONS FOR LCD MODULE

File Size 361.82K  /  21 Page

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    ATP154-1

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AZ Displays, Inc.
Part No. ATP154-1
OCR Text ...con Rubber with hardness at 60C pencil hardness 2H minimum against specification JIS K-5400 78% min. measured in the effective input area to JIS K 7105 using a MURAKAMI SHIKISAI KENKYUSHO type IIR 100 meter. 5% type measured in the effec...
Description SPECIFICATIONS FOR STANDARD RESISITIVE TOUCH PANEL

File Size 1,130.96K  /  7 Page

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    STGB18N40LZ0805 STGD18N40LZ-1

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STMicroelectronics
Part No. STGB18N40LZ0805 STGD18N40LZ-1
OCR Text ... 1 DPAK Application pencil coil electronic ignition driver Figure 1. Internal schematic diagram Description This IGBT utilizes the advanced PowerMESHTM process resulting in an excellent trade-off between switching perf...
Description EAS 180 mJ - 400 V - internally clamped IGBT

File Size 610.13K  /  18 Page

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    STGD18N40LZ STGB18N40LZ STGB18N40LZ-1 STGB18N40LZT4 STGD18N40LZT4 STGD18N40LZ-1

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STMicroelectronics
Part No. STGD18N40LZ STGB18N40LZ STGB18N40LZ-1 STGB18N40LZT4 STGD18N40LZT4 STGD18N40LZ-1
OCR Text ... 1 DPAK Application pencil coil electronic ignition driver Figure 1. Internal schematic diagram Description This IGBT utilizes the advanced PowerMESHTM process resulting in an excellent trade-off between switching perf...
Description EAS 180 mJ - 400 V - internally clamped IGBT

File Size 606.37K  /  18 Page

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    CAB-PSR1 CAB.6SR CAB-8SR CAB-6SR

Ohmite Mfg. Co.
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Part No. CAB-PSR1 CAB.6SR CAB-8SR CAB-6SR
OCR Text pencil) 1 adhesive transfer pin 2 10cc syringes 4 syringe needles 1 pair tweezers 2 optical magnifiers (3x & 6x) * Resistors packed by value in clearly identified vials. * Cabinet drawers clearly identify contents. Electrical Resistance...
Description Surface Mount Resistor Assortments

File Size 78.29K  /  1 Page

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    MA4AGBLP912

M/A-COM Technology Solutions, Inc.
Part No. MA4AGBLP912
OCR Text ...handled with tweezers. A vacuum pencil with a #27 tip is recommended for picking and placing. Attachment These devices were designed to be inserted onto hard or soft substrates. Recommended methods of attachment include thermo-compression b...
Description AlGaAs Beamlead PIN Diode

File Size 81.51K  /  4 Page

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    MADS-001317-1320AG

M/A-COM Technology Solutions, Inc.
Part No. MADS-001317-1320AG
OCR Text ...matically with a #27 tip vacuum pencil. Assembly Requirements using Tin Lead Solder This Flip Chip Diode employs a 6 m thick, Sn 63/Pb 37 Solderable interface as part of the 50 m high solder bump. These chips are designed to be soldered...
Description GaAs Solder Bump Flip Chip Schottky Diode

File Size 142.20K  /  3 Page

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    MADP-000910-13050P MA4AGP907 MA4AGFCP910 MADP-001907-13050P

M/A-COM Technology Solutions, Inc.
Part No. MADP-000910-13050P MA4AGP907 MA4AGFCP910 MADP-001907-13050P
OCR Text ...nd placed with a #27 tip vacuum pencil. Assembly Requirements using Electrically Conductive Silver Epoxy and Solder These chips are designed to be inserted onto hard or soft substrates with the junction side down. They should be mounted...
Description AlGaAs Flip Chip PIN Diodes

File Size 122.34K  /  6 Page

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    MA4AGSBP907

M/A-COM Technology Solutions, Inc.
Part No. MA4AGSBP907
OCR Text ...matically with a #27 tip vacuum pencil. Assembly Requirements using Tin / Lead Solder The flip chip diode employs a 6m thick, Sn/Pb, 63/37 solderable interface as part of the 50m high solder bump. These chips are designed to be soldered...
Description AlGaAs Solder Bump Flip-Chip PIN Diode

File Size 170.15K  /  5 Page

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    MA4GP905

M/A-COM Technology Solutions, Inc.
Part No. MA4GP905
OCR Text ...handled with tweezers. A vacuum pencil with a #27 tip is recommended for picking and placing. Attachment These devices were designed to be inserted onto hard or soft substrates. Recommended methods of attachment include thermo-compression b...
Description GaAs Beamlead PIN Diode

File Size 76.56K  /  3 Page

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For pencil Found Datasheets File :: 119    Search Time::1.375ms    
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