high power sm mold package pdf Datasheet P4 Description --- IC-ON-LINE


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high power sm mold package Datasheet PDF File

For high power sm mold package Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

				NEC
Part No.	2SC2954 2SC2954-T1
Description	For amplify high frequency, low noise, and wide band. NPN SILICON EPITAXIAL TRANSISTOR power MINI mold
File Size	102.11K / 8 Page	View it Online	Download Datasheet

				ETC[ETC]
Part No.	LBT-125
Description	Compact package based on the double-mold method
File Size	145.97K / 3 Page	View it Online	Download Datasheet

				ETC[ETC]
Part No.	LBT-121
Description	Compact package based on the double-mold method.
File Size	154.13K / 3 Page	View it Online	Download Datasheet

				M/A-COM Technology Solutions, Inc.
Part No.	28333-PCN-001-A
Description	mold Compound and Die Attach Change for ETQFP package
File Size	12.34K / 2 Page	View it Online	Download Datasheet


Part No.	2SK67AJ2 2SK67AJ4
Description	10 mA, N-CHANNEL, Si, smALL SIGNAL, MOSFET MINI mold package-3
File Size	2,544.43K / 4 Page	View it Online	Download Datasheet

				NEC Electronics NEC[NEC] NEC Corp.
Part No.	5P4J 5P6J 5P6J-Z 596J 5P4J-Z
Description	5A mold SCR 5 A smALL mold THYRISTOR
File Size	1,242.82K / 6 Page	View it Online	Download Datasheet

				NEC Corp. NEC[NEC]
Part No.	2SC5180
Description	ECONOLINE: RY & RX - Controllable Output- 1kVDC Isolation- No Heatsink Required- UL94V-0 package Material- Toroidal Magnetics- No External Components- Fully Encapsulated- Efficiency to 70% NPN EPITAXIAL SILICON TRANSISTOR IN SUPER MINI-mold package FOR LOW-NOISE MICROWAVE AMPLIFICATION
File Size	52.07K / 8 Page	View it Online	Download Datasheet

				NEC Electronics NEC[NEC] NEC Corp.
Part No.	5P6smA 5P4smA
Description	5A mold isolated SCR From old datasheet system P gate all Diffused mold type Thyristor granted 5 A on-state Average current, with rated Voltages up to 600V
File Size	246.43K / 6 Page	View it Online	Download Datasheet

				Sharp Corporation Sharp Electrionic Components
Part No.	GL390 GL390V
Description	Thin Bow Type Resin mold package Infrared Emitting Diodes
File Size	38.16K / 4 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	U1GC44
Description	Average Forward Current Repetitive Peak Reverse Voltage Mini Plastic mold package
File Size	204.61K / 4 Page	View it Online	Download Datasheet

For high power sm mold package Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |