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130A0 6060845 5BR10 1N5420 SG112 SC531 2SB1103 CY123
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  boiling Datasheet PDF File

For boiling Found Datasheets File :: 248    Search Time::1.531ms    
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    NTE[NTE Electronics]
Part No. 35-91201
OCR Text ....5 Specific Gravity (70F) 0.856 boiling Point: 180F Melting Point: No Data Evaporation Rate (Butyl Acetate = 1) >1 Vapor Pressure (mm-Hg @ 70F) No Data Vapor Density (AIR = 1) >1 Solubility in Water Complete Volatile Organic Compounds (VOCs...
Description Solar Guard Sunscreen Towel

File Size 23.75K  /  4 Page

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    NTE Electronics, Inc.
NTE[NTE Electronics]
Part No. 35-91401
OCR Text .../A Specific Gravity (70F) 0.859 boiling Point: 180F Melting Point: No Data Evaporation Rate (Butyl Acetate = 1) No Data Vapor Pressure (mm-Hg @ 70F) No Data Vapor Density (AIR = 1) >1 Solubility in Water Complete Volatile Organic Compounds ...
Description Insect Shield Insect Repellant Towel

File Size 25.15K  /  4 Page

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    FUJI[Fuji Electric]
Part No. 6MBI75U2A-060
OCR Text ...ed liquid : W ater with ice and boiling water Dipping time : 5 min. par each temp. Transfer time : 10 sec. Number of cycles : 10 cycles +5 -0 Test Method 307 m ethod Condition code A 5 (0:1) MS5F 5743 6 13 H04-004-03a ...
Description IGBT module

File Size 775.22K  /  13 Page

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    PANASONIC[Panasonic Semiconductor]
Part No. LN189L
OCR Text ... solutions for purposes such as boiling tests or ultrasonic cleaning. [Ability to withstand soldering heat] The package of this product contains thermoplastic resin which has a limited ability to withstand heat. Therefore this product canno...
Description GaAlAs Infrared Light Emitting Diode

File Size 43.01K  /  2 Page

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    PANASONIC[Panasonic Semiconductor]
Part No. LN189M
OCR Text ... solutions for purposes such as boiling tests or ultrasonic cleaning. [Ability to withstand soldering heat] The package of this product contains thermoplastic resin which has a limited ability to withstand heat. Therefore this product canno...
Description GaAlAs Infrared Light Emitting Diode

File Size 35.49K  /  2 Page

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    PANASONIC[Panasonic Semiconductor]
Part No. LN189S
OCR Text ... solutions for purposes such as boiling tests or ultrasonic cleaning. [Ability to withstand soldering heat] The package of this product contains thermoplastic resin which has a limited ability to withstand heat. Therefore this product canno...
Description GaAlAs Infrared Light Emitting Diode

File Size 43.06K  /  2 Page

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    FUJI[Fuji Electric]
Part No. MS5F6015
OCR Text ...sed liquid : Water with ice and boiling water Dipping time : 5 min. par each temp. Transfer time : 10 sec. Number of cycles : 10 cycles +5 -0 Test Method 307 method Condition code A 5 (0:1) MS5F6015 6 13 a H04-004-0...
Description IGBT MODULE

File Size 459.14K  /  13 Page

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    FUJI[Fuji Electric]
Part No. MS5F6058
OCR Text ...sed liquid : Water with ice and boiling water Dipping time : 5 min. par each temp. Transfer time : 10 sec. Number of cycles : 10 cycles +5 -0 Test Method 307 method Condition code A 5 (0:1) MS5F6058 6 13 a H04-004-0...
Description IGBT MODULE

File Size 423.78K  /  13 Page

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    NTE[NTE Electronics]
Part No. NTE303A
OCR Text ...olatiles % by vol.: Approximate boiling Point (deg.F): Drop Point: No data <1 <1 > 400F negligible > 400 None Physical State: Heavy grease Color: White Odor: Nil Molecular Weight: Not applicable to mixtures pH (@ 25 Deg. C): Not applicab...
Description Silicone Heat Sink Compound

File Size 27.03K  /  5 Page

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    NTE[NTE Electronics]
Part No. NTE303
OCR Text ...STRONG ACID: NO STRONG BASE: NO boiling POINT (DEG F): +600 F MELTING POINT (DEG F): N.A. APPEARANCE AND ODOR: WHITE GEL, ODORLESS 3. REACTIVITY DATA STABILITY: STABLE NOTE: INCOMPATIBILITY: KEEP AWAY FROM STRONG OXIDIZERS HAZARDOU...
Description Thermal Grease

File Size 89.18K  /  3 Page

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For boiling Found Datasheets File :: 248    Search Time::1.531ms    
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