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  73944-5217 Datasheet PDF File

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    0739446002

Molex Electronics Ltd.
Part No. 0739446002
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 72 Circuits
File Size 153.82K  /  4 Page

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Amphenol Communications Solutions
Part No. 73944-2002LF
Description Metral® Board Connectors, Backplane Connectors, Signal Receptacle, Right Angle, Press Fit, 5 Rows, 210 Positions.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    73944-7001 0739447001

Molex Electronics Ltd.
Part No. 73944-7001 0739447001
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Solder Tail, Guide Pin Option, 144 Circuits
File Size 154.08K  /  4 Page

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Amphenol Communications Solutions
Part No. 73944-1003LF
Description Metral® Board Connectors, Backplane Connectors, Signal Receptacle, Right Angle, Through Hole, 5 Rows, 210 Positions.
Tech specs 　 　

Official Product Page

    73944-7217 0739447217

Molex Electronics Ltd.
Part No. 73944-7217 0739447217
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits
File Size 154.26K  /  4 Page

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Amphenol Communications Solutions
Part No. 73944-1002LF
Description Metral® Board Connectors, Backplane Connectors, Signal Receptacle, Right Angle, Press Fit, 5 Rows, 210 Positions.
Tech specs 　 　

Official Product Page

    0739447005

Molex Electronics Ltd.
Part No. 0739447005
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Solder Tail, Guide Pin Option, 144 Circuits
File Size 153.83K  /  4 Page

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Amphenol Communications Solutions
Part No. 68739-444HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 44 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    73944-5000 0739445000

Molex Electronics Ltd.
Part No. 73944-5000 0739445000
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits
File Size 153.82K  /  4 Page

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Amphenol Communications Solutions
Part No. 68739-448HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 48 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    73944-5003 0739445003

Molex Electronics Ltd.
Part No. 73944-5003 0739445003
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits
File Size 153.82K  /  4 Page

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Amphenol Communications Solutions
Part No. 68739-446HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 46 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    0739447000

Molex Electronics Ltd.
Part No. 0739447000
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Solder Tail, Guide Pin Option, 144 Circuits
File Size 154.08K  /  4 Page

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Amphenol Communications Solutions
Part No. 68739-442HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 42 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    0739446000

Molex Electronics Ltd.
Part No. 0739446000
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 72 Circuits
File Size 154.08K  /  4 Page

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Amphenol Communications Solutions
Part No. 68739-440HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    0739446001

Molex Electronics Ltd.
Part No. 0739446001
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 72 Circuits
File Size 154.08K  /  4 Page

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Amphenol Communications Solutions
Part No. 87052-170HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 70 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs 　 　

Official Product Page

    0739446200 73944-6200

Molex Electronics Ltd.
Part No. 0739446200 73944-6200
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 72 Circuits
File Size 154.08K  /  4 Page

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Amphenol Communications Solutions
Part No. 10131935-217ULF
Description Minitek®, Board to Board, Receptacle, Surface Mount, Single row, 17 Positions, 2mm (0.079inch), Vertical.
Tech specs 　 　

Official Product Page

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