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  71308-6444 Datasheet PDF File

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    71308-5470

Molex Electronics Ltd.
Part No. 71308-5470
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 70 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 10135584-644402LF
Description Bergstak® 0.80mm Pitch, Board to Board Vertical Header, Dual Row, 64 Positions, 0.80mm (0.031in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    71308-5480

Molex Electronics Ltd.
Part No. 71308-5480
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 80 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 80 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.55K  /  8 Page

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Amphenol Communications Solutions

Part No. 10028916-4444P00LF
Description AirMax® Power Connectors, Backplane Connectors, 2-Pair, 2 Column, Vertical Receptacle, Press-Fit
Tech specs    

Official Product Page

    71308-0034N

Molex Electronics Ltd.
Part No. 71308-0034N
Description 2.54mm Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 34 Circuits, Tin (Sn) Plating, without PCB Locator Pegs

File Size 27.04K  /  2 Page

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Amphenol Communications Solutions

Part No. 77316-444LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single row , Polarized, 7 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    71308-0028N

Molex Electronics Ltd.
Part No. 71308-0028N
Description 2.54mm Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 28 Circuits, Tin (Sn) Plating, without PCB Locator Pegs

File Size 27.04K  /  2 Page

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Amphenol Communications Solutions

Part No. 68464-442HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 42 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71308-0026N

Molex Electronics Ltd.
Part No. 71308-0026N
Description 2.54mm Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 26 Circuits, Tin (Sn) Plating, without PCB Locator Pegs

File Size 27.04K  /  2 Page

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Amphenol Communications Solutions

Part No. 68464-440HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71308-4026N

Molex Electronics Ltd.
Part No. 71308-4026N
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 26 Circuits, Tin (Sn) Plating, with 3.30mm (.130) PCB Locator Pegs

File Size 1,475.61K  /  8 Page

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Amphenol Communications Solutions

Part No. 10147212-644406LF
Description Bergstak® Shielded 0.8mm Receptacle 64P
Tech specs    

Official Product Page

    71308-4244N

Molex Electronics Ltd.
Part No. 71308-4244N
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 44 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, with 3.30mm (.130) PCB Locator Pegs

File Size 1,475.64K  /  8 Page

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Amphenol Communications Solutions

Part No. 67996-444HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 44 Positions, 2.54 mm (0.100in) Pitch
Tech specs    

Official Product Page

    71308-0022N

Molex Electronics Ltd.
Part No. 71308-0022N
Description 2.54mm Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 22 Circuits, Tin (Sn) Plating, without PCB Locator Pegs

File Size 27.04K  /  2 Page

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Amphenol Communications Solutions

Part No. 68464-446HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 46 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71308-0024N

Molex Electronics Ltd.
Part No. 71308-0024N
Description 2.54mm Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 24 Circuits, Tin (Sn) Plating, without PCB Locator Pegs

File Size 27.04K  /  2 Page

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Amphenol Communications Solutions

Part No. 68464-448HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 48 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71308-0018N

Molex Electronics Ltd.
Part No. 71308-0018N
Description 2.54mm Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 18 Circuits, Tin (Sn) Plating, without PCB Locator Pegs

File Size 27.04K  /  2 Page

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Amphenol Communications Solutions

Part No. 68464-444HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 44 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

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