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  52746-1571 Datasheet PDF File

For 52746-1571 Found Datasheets File :: 134+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 |   

    0527461671 52746-1671

Molex Electronics Ltd.
Part No. 0527461671 52746-1671
Description 0.50mm (.020") Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom ContactStyle, 16 Circuits, Lead-free, Gold Contact Plating, High Barrier Packaging
0.50mm (.020) Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom ContactStyle, 16 Circuits, Lead-free, Gold Contact Plating, High Barrier Packaging

File Size 529.77K  /  7 Page

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Amphenol Communications Solutions

Part No. 95157-112LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Double Row, 12 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0527460971 52746-0971

Molex Electronics Ltd.
Part No. 0527460971 52746-0971
Description 0.50mm (.020) Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom Contact Style, 9 Circuits, Lead-free, Gold Contact Plating, High BarrierPackaging
MOLEX Connector

File Size 529.36K  /  6 Page

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Amphenol Communications Solutions

Part No. 69157-172H
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    52746-1971 0527461971

Molex Electronics Ltd.
Part No. 52746-1971 0527461971
Description 0.50mm (.020) Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom Contact Style, 19 Circuits, Lead-free, Gold Contact Plating, High Barrier Packaging

File Size 529.77K  /  7 Page

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Amphenol Communications Solutions

Part No. 95157-116VLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Double Row, 16 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0527460771 52746-0771

Molex Electronics Ltd.
Part No. 0527460771 52746-0771
Description 0.50mm (.020) Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom ContactStyle, 7 Circuits, Lead-free, Gold Contact Plating, High BarrierPackaging
MOLEX Connector

File Size 529.86K  /  7 Page

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Amphenol Communications Solutions

Part No. 69157-102HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 2 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0527460671 52746-0671

Molex Electronics Ltd.
Part No. 0527460671 52746-0671
Description 0.50mm (.020) Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom ContactStyle, 6 Circuits, Lead-free, Gold Contact Plating, High BarrierPackaging
MOLEX Connector

File Size 529.86K  /  7 Page

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Amphenol Communications Solutions

Part No. 69157-126HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 26 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0527460471 52746-0471

Molex Electronics Ltd.
Part No. 0527460471 52746-0471
Description 0.50mm (.020) Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom ContactStyle, 4 Circuits, Lead-free, Gold Contact Plating, High BarrierPackaging
MOLEX Connector

File Size 529.86K  /  7 Page

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Amphenol Communications Solutions

Part No. 69157-146HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 46 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0527462071 52746-2071

Molex Electronics Ltd.
Part No. 0527462071 52746-2071
Description 0.50mm (.020) Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom ContactStyle, 20 Circuits, Lead-free, Gold Contact Plating, High Barrier Packaging
MOLEX Connector

File Size 529.86K  /  7 Page

View it Online

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Amphenol Communications Solutions

Part No. 69157-166HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 66 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0527461271 52746-1271

Molex Electronics Ltd.
Part No. 0527461271 52746-1271
Description 0.50mm (.020") Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom Contact Style, 12 Circuits, Lead-free, Gold Contact Plating, High Barrier Packaging
0.50mm (.020) Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom Contact Style, 12 Circuits, Lead-free, Gold Contact Plating, High Barrier Packaging

File Size 529.80K  /  7 Page

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Amphenol Communications Solutions

Part No. 95157-108V
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Double Row, 8 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0527461171 52746-1171

Molex Electronics Ltd.
Part No. 0527461171 52746-1171
Description 0.50mm (.020) Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom ContactStyle, 11 Circuits, Lead-free, Gold Contact Plating, High Barrier Packaging

File Size 529.78K  /  7 Page

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Amphenol Communications Solutions

Part No. 95157-116TB07LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Double Row, 16 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0527461871 52746-1871

Molex Electronics Ltd.
Part No. 0527461871 52746-1871
Description 0.50mm (.020) Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom ContactStyle, 18 Circuits, Lead-free, Gold Contact Plating, High Barrier Packaging

File Size 529.77K  /  7 Page

View it Online

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Amphenol Communications Solutions

Part No. 95157-120LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Double Row, 20 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 52746-1571 Found Datasheets File :: 134+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 |   

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