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Molex Electronics Ltd.
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Part No. |
70246-4402 0702464402 70246-6402
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Description |
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 64 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 44Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 44Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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File Size |
175.94K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68464-408HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 8 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68464-432HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 32 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68464-454HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 54 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10135584-644402LF
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Description |
Bergstak® 0.80mm Pitch, Board to Board Vertical Header, Dual Row, 64 Positions, 0.80mm (0.031in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68464-414HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 14 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68464-436HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68464-458HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 58 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68464-410HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 10 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68464-434HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 34 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68464-456HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 56 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Bom2Buy.com

Price and Availability
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