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Rochester Electronics LLC |
| Part No. |
TSL1401CCS
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| Description |
TSL1401 - 128 x 1 Linear Sensor Array With Hold
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10132449-1411GBTLF
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| Description |
Minitek® Pwr 3.0 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Black Color, 14 Positions, GW Compatible PA9T, With Shorter Tail Length & Peg, Tape and Reel.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10132449-1411GLF
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| Description |
Minitek® Pwr 3.0 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Black Color, 14 Positions, GW Compatible PA9T, Tray packing.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
44914-0403 0449140403
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| Description |
3.00mm (.118") Pitch Micro-Fit 3.0 CPI Header, Dual Row, Vertical, Compliant Pin Interface, 4 Circuits, LCP
3.00mm (.118) Pitch Micro-Fit 3.0 CPI Header, Dual Row, Vertical, Compliant Pin Interface, 4 Circuits, LCP
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| File Size |
169.88K /
3 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10132449-1421GLF
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| Description |
Minitek® Pwr 3.0 HCC, Dual Row, Right Angle Through Hole Header, 80u\\ Min Matte Tin plating, Black Color, 14 Positions, GW Compatible PA9T, Tray packing.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
44914-1603 SD-44914-001 0449141603
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| Description |
3.00mm (.118") Pitch Micro-Fit 3.0 CPI Header, Dual Row, Vertical, Compliant Pin Interface, 16 Circuits, LCP, Glass-Filled
3.00mm (.118) Pitch Micro-Fit 3.0 CPI Header, Dual Row, Vertical, Compliant Pin Interface, 16 Circuits, LCP, Glass-Filled
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| File Size |
169.88K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
RJMG1C8449141ER
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| Description |
RJMG, Input output Connectors, 1x1 10/100 with LED
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
SD-44914-001 44914-0401 0449140401
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| Description |
3.00mm (.118") Pitch Micro-Fit 3.0 CPI Header, Compliant Pin Interface, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating
3.00mm (.118) Pitch Micro-Fit 3.0 CPI Header, Compliant Pin Interface, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating
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| File Size |
172.89K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
RJMG1C8449141CR
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| Description |
RJMG 1x1 10/100, RightAngle
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
SD-44914-001 0449141002 44914-1002
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| Description |
3.00mm (.118") Pitch Micro-Fit 3.0 CPI Header, Dual Row, Vertical, Compliant Pin Interface, 10 Circuits, LCP, Glass-Filled
3.00mm (.118) Pitch Micro-Fit 3.0 CPI Header, Dual Row, Vertical, Compliant Pin Interface, 10 Circuits, LCP, Glass-Filled
|
| File Size |
169.89K /
3 Page |
View
it Online |
Download Datasheet |
| |
|
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Amphenol Communications Solutions |
| Part No. |
10132449-1421GBTLF
|
| Description |
Minitek® Pwr 3.0 HCC, Dual Row, Right Angle Through Hole Header, 80u\\ Min Matte Tin plating, Black Color, 14 Positions, GW Compatible PA9T, With Shorter Tail Length & Peg, Tape and Reel.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10116951-4015LF
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| Description |
CXP Passive Copper Cable Assemblies, Passive, 10Gb/s, 26 AWG, 1.5m, non-halogen free
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10076801-401A20LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 20 Positions, 2.54mm (0.100in) Pitch, Pin In Paste
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
ME1014013401201
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| Description |
Mini Cool Edge 0.60mm Connectors, Storage & Server System, Gen Z,EDSFF,OCP 3.0,140 signal pins, SMT,Straddle mount, 2.36mm PCB,0.0mm offset .
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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