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  25m-pitch Datasheet PDF File

For 25m-pitch Found Datasheets File :: 358    Search Time::2.141ms    
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    Mitsubishi Electric Corporation
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. M5M5V416BUG-70HI
OCR Text ...itsubishi's high-perf ormance 0.25m CMOS technology . The M5M5V416B is suitable f or memory applications where a simple interf acing , batte...pitch of 0.75mm. It giv es the best solution f or a compaction of mounting area as well as f lexibil...
Description 4194304-BIT (262144-WORD BY 16-BIT) CMOS STATIC RAM

File Size 88.33K  /  10 Page

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    MITSUBISHI[Mitsubishi Electric Semiconductor]
Mitsubishi Electric Corporation
Mitsubishi Electric, Corp.
http://
Part No. M5M5V416WG-70LI M5M5V416BWG M5M5V416BWG-10H M5M5V416BWG-10HI M5M5V416BWG-10HW M5M5V416BWG-10L M5M5V416BWG-10LI M5M5V416BWG-10LW M5M5V416BWG-70H M5M5V416BWG-70HI M5M5V416BWG-70HW M5M5V416BWG-70L M5M5V416BWG-70LW M5M5V416BWG-85H M5M5V416BWG-85HI M5M5V416BWG-85HW M5M5V416BWG-85L M5M5V416BWG-85LI M5M5V416BWG-85LW M5M5V416BWG-70LI
OCR Text ...itsubishi's high-perf ormance 0.25m CMOS technology . The M5M5V416B is suitable f or memory applications where a simple interf acing , batte...pitch of 0.75mm. It giv es the best solution f or a compaction of mounting area as well as f lexibil...
Description 4194304-BIT (262144-WORD BY 16-BIT) CMOS STATIC RAM 4194304位(262144字由16位)的CMOS静态RAM

File Size 104.93K  /  10 Page

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    OKI electronic components
OKI[OKI electronic componets]
Part No. MG65P MG63P MG64P
OCR Text 25m Embedded DRAM/ Customer Structured Arrays November 1998 MG63P/64P/65P 0.25m Embedded DRAM/Customer Structured Arrays DESCRIPTION O...pitch Configurable I/O pads for VDD, VSS, or I/O (optimized 3-V I/O) VDD and VSS pads dedicated to w...
Description 0.25m Embedded DRAM/ Customer Structured Arrays
0.25レm Embedded DRAM/ Customer Structured Arrays

File Size 125.78K  /  22 Page

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    NJRC[New Japan Radio]
Part No. NJU6820CJ NJU6820
OCR Text ...48m, 1013m) ( 9248m, -1013m) 25m 1 DMY48 DMY49 D14 DMY50 DMY51 D15 DMY52 DMY53 VDD VDD DMY54 DMY55 CL DMY56 DMY57 FLM DMY58 DMY59 F...Pitch Bump Size Bump hight Bump Material :X=0um, Y=0um :X=18.86mm, Y= 2.39mm :625um + 25um :42um(...
Description 40-common x 128RGB-Segment, in 4096-Color 4096-Color STN LCD DRIVER

File Size 934.24K  /  101 Page

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    NJRC[New Japan Radio]
Part No. NJU6824
OCR Text ... Y= 0m :22.07mm x 2.55mm :625m 25m :28m x 110m(COM/SEG Output, DMY10 ~ DMY71), 60m x 100m(Interface), 28m x 100m(DMY0 ~ DMY9) :43m(Min) :14.0~22.5m (Typical 18m) <tolerance : 3m > :Au Bump Pitch Bump Height Bump Material Alignment ma...
Description 128-common x (128+2) RGB-Segment, in 4096-Color STN LCD DRIVER

File Size 967.89K  /  110 Page

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    AMI[AMI SEMICONDUCTOR]
Part No. PI1024HSN PI0000HSN PI0256HSN PI0512HSN
OCR Text ...ng Data Sheet 2 Dummy Pixels 25m Active Pixels 2 Dummy Pixels 2500m Figure2. Geometry and layout of photodiode pixels. During normal operation, the photons incident in or near the NP photodiode junction generate free charg...
Description 25-μm-Pitch Wide Aperture Spectroscopic Photodiode Arrays
25-レm-Pitch Wide Aperture Spectroscopic Photodiode Arrays

File Size 543.05K  /  8 Page

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    HM17CM4096

ETC
Part No. HM17CM4096
OCR Text ...chip : 19.83mm 2.96mm : 525m 25m : 68m 33m, 68m 80m : 45m(Min) : 18 3m : Au -2- HM17CM4096 DMY3(R) DMY3(L) COM21 DMY4(L) DMY4(R) COM20 COM19 COM18 COM17 COM80 COM69 DMY2(R) DMY2(L) DMY1(R) DMY1(L) COM70 COM3 C...
Description 128XRGBX162 OUTPUT LCD DRIVER IC with built-in RAM

File Size 1,084.26K  /  67 Page

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    FMA3051-000 FMA3051

Filtronic Compound Semicond...
Filtronic Compound Semiconductors
Part No. FMA3051-000 FMA3051
OCR Text ...s be made using bond wires with 25m diameter and a maximum length of 300m. C2 C2 C2 C2 AA Z YX W V U T S R Q P ON A B C D E F GH I J K L M C2 C2 C2...
Description 12.5-15.5 GHZ MMIC HIGH POWER AMPLIFIER

File Size 108.71K  /  6 Page

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    FMS2023-000-WP FMS20231

Filtronic Compound Semiconductors
Part No. FMS2023-000-WP FMS20231
OCR Text ...n to give effective results for 25m wire. Ultrasonic energy shall be kept to a minimum. For this bonding technique, stage temperature should not be raised above 200C and bond force should not be raised above 60g. Thermosonic wedge bonding a...
Description DC-20 GHZ MMIC LOW LOSS SPST ABSORPTIVE SWITCH

File Size 143.09K  /  5 Page

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    FMS2029-000-WP FMS20291

Filtronic Compound Semiconductors
Part No. FMS2029-000-WP FMS20291
OCR Text ...n to give effective results for 25m wire. Ultrasonic energy shall be kept to a minimum. For this bonding technique, stage temperature should not be raised above 200C and bond force should not be raised above 60g. Thermosonic wedge bonding a...
Description DC-20 GHZ MMIC SPST ABSORPTIVE SWITCH

File Size 143.50K  /  5 Page

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For 25m-pitch Found Datasheets File :: 358    Search Time::2.141ms    
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