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Intersil
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Part No. |
ACS630MS
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OCR Text |
... 1.125kA Metal 2 Thickness: 9kA 1ka GLASSIVATION: Type: SiO2 Thickness: 8kA 1ka WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 110m x 110m 4.4 mils x 4.4 mils
Metallization Mask Layout
ACS630MS
DB2 DB1 DB0 DEF VCC SEF S1 (4... |
Description |
EDAC, Error Detection and Correction Circuit, Rad-Hard, Advanced Logic, CMOS
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File Size |
269.58K /
3 Page |
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it Online |
Download Datasheet
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Part No. |
IRGC49B120UB
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OCR Text |
...hickness) al - ti - ni/v - ag, (1ka - 1ka - 4ka - 6ka) nominal front metal composition, (thickness) 99% al/1% si, (4m) dimensions 0.305" x 0.390" wafer diameter 150mm, with std. < 100 > flat wafer thickness, tolerance 185m, +/-15m relevant... |
Description |
1200 V, N-CHANNEL IGBT TRANSISTOR | IGBT | N-CHAN | 1.2KV V(BR)CES | CHIP
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File Size |
15.03K /
1 Page |
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it Online |
Download Datasheet
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Price and Availability
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