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  1140-4013 Datasheet PDF File

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    1140-4028

Molex Electronics Ltd.
Part No. 1140-4028
Description Insulation Punch

File Size 11.51K  /  1 Page

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Amphenol Communications Solutions

Part No. 1140084168
Description 1140084168-Micro SD Normal Open H=1.55 NONE PUSH
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    1140-4032

Molex Electronics Ltd.
Part No. 1140-4032
Description Insulation Punch

File Size 14.44K  /  1 Page

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Rochester Electronics LLC

Part No. 4013B/BCA
Description Replacement for National Semiconductor part number M38510/05151BCA. Buy from authorized manufacturer Rochester Electronics.
Tech specs    

Official Product Page

    Digital Equipment
Part No. 21140
Description DEC Chip

File Size 1,461.58K  /  43 Page

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Rochester Electronics LLC

Part No. 4013A/BCA
Description Replacement for National Semiconductor part number M38510/05101BCA. Buy from authorized manufacturer Rochester Electronics.
Tech specs    

Official Product Page

    D1140

Toshiba Semiconductor
Part No. D1140
Description Search --To 2SD1140

File Size 224.30K  /  4 Page

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Amphenol Communications Solutions

Part No. 77311-401-31LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 31 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    1140-4027

Molex Electronics Ltd.
Part No. 1140-4027
Description Conductor Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-35LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    1140-4018

Molex Electronics Ltd.
Part No. 1140-4018
Description Conductor Punch

File Size 14.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    1140-4129

Molex Electronics Ltd.
Part No. 1140-4129
Description Barrel Form Punch

File Size 11.51K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-32LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    1140-4126

Molex Electronics Ltd.
Part No. 1140-4126
Description Barrel Form Punch

File Size 11.60K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-33LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    Pulse Engineering, Inc.
Part No. H1140
Description
File Size 173.82K  /  4 Page

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Amphenol Communications Solutions

Part No. 77311-401-30LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    CSS-4012G CSS-4013G

China Semiconductor Corporation
Part No. CSS-4012G CSS-4013G
Description 4.0 Inch Single Digit Display

File Size 193.14K  /  6 Page

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Amphenol Communications Solutions

Part No. 77311-401-34LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

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