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STATSCHIP[STATS ChipPAC, Ltd.]
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Part No. |
BCC BCCS__ BCC_ BCC__ BCCS_
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OCR Text |
...ns 279m nominal, 355m max. 25m (1.0mils) diameter Preplated Ni/Pd/Au bumps Laser Tape & reel / JEDEC tray
RELIABILITY
Moisture Sensitivi...31-639-8911 TAIWAN 886-3-593-6565 CHINA 86-21-5976-5858 UK 44-1483-413-700 MALAYSIA 603-4257-6222 NE... |
Description |
Bump Chip Carrier
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File Size |
585.29K /
2 Page |
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it Online |
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STATSCHIP[STATS ChipPAC, Ltd.]
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Part No. |
LFBGA-H FBGA
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OCR Text |
1.40mm (LFBGA), 1.20mm (TFBGA), and 1.00mm (VFBGA), 0.80mm (WFBGA) and 0.55mm (UFBGA) maximum thickness * Laminate substrate based package w...31-639-8911 TAIWAN 886-3-593-6565 CHINA 86-21-5976-5858 UK 44-1483-413-700 MALAYSIA 603-4257-6222 NE... |
Description |
Fine Pitch Ball Grid Array
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File Size |
555.50K /
2 Page |
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it Online |
Download Datasheet
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List of Unclassifed Manufac... ETC[ETC] N.A.
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Part No. |
TP337 TP337E TP337A
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OCR Text |
...740*1740 Diameter 545 625 60 85 1.3*108 16 31 0.36 ---
------m2 m
Thickness of substrate Resistance of thermopile Sensitivity Detecctivity Time constant Noise voltage NEP Temperature range Temperature reference resistor Resistance
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Description |
Thermopile Infrared Sensor
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File Size |
211.34K /
9 Page |
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it Online |
Download Datasheet
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Price and Availability
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