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NXP
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Part No. |
SL2ICS2001V1D
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OCR Text |
sawn wafers on ffc with uv-tape of i-code sli label ics on an nxp c075ee process and is the base for delivery of tested i-code sli label ics. 2. ordering information 3. mechanical specification 3.1 wafer ? diameter: 8? ? thickness: 150 ... |
Description |
I-CODE SLI Label IC bumped wafer specification on UV-tape
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File Size |
198.40K /
9 Page |
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it Online |
Download Datasheet
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NXP Semiconductors N.V.
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Part No. |
SL1ICS3001W/N4D
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OCR Text |
............. 15 11.2.1 packing of sawn wafers ................................ ................................ ............................. 15 12 handling recommendations 16 12.1 assembly ................................ ...................... |
Description |
I-CODE1 Label IC SPECIALTY CONSUMER CIRCUIT, UUC
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File Size |
343.06K /
24 Page |
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it Online |
Download Datasheet
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Price and Availability
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