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AZ Displays, Inc.
AZDISPLAYS[AZ Displays]
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| Part No. |
ATP0574-1
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| OCR Text |
...con Rubber with hardness at 60C pencil hardness 2H minimum against specification JIS K-5400
78% min. measured in the effective input area to JIS K 7105 using a MURAKAMI SHIKISAI KENKYUSHO type IIR 100 meter. 5% type measured in the effec... |
| Description |
SPECIFICATIONS FOR STANDARD RESISITIVE TOUCH PANEL
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| File Size |
863.29K /
7 Page |
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it Online |
Download Datasheet
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AZ Displays, Inc.
AZDISPLAYS[AZ Displays]
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| Part No. |
ATP0644-3
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| OCR Text |
...con Rubber with hardness at 60C pencil hardness 2H minimum against specification JIS K-5400
78% min. measured in the effective input area to JIS K 7105 using a MURAKAMI SHIKISAI KENKYUSHO type IIR 100 meter. 5% type measured in the effec... |
| Description |
SPECIFICATIONS FOR STANDARD RESISTIVE TOUCH PANEL
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| File Size |
916.39K /
7 Page |
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it Online |
Download Datasheet |
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SKYWORKS[Skyworks Solutions Inc.]
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| Part No. |
DSG9500-000
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| OCR Text |
...handled through use of a vacuum pencil using an appropriate size vacuum needle or a pointed wooden stick such as a sharpened Q-tip or match stick. The device will adhere to the point and can easily be removed from the container and position... |
| Description |
Planar Beam Lead PIN Diode
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| File Size |
68.53K /
5 Page |
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it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MA4AGSBP907-W MA4AGSBP907 MA4AGSBP907-T
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| OCR Text |
...matically with a #27 tip vacuum pencil.
Assembly Requirements using Tin Lead Solder
The Flip Chip Diode employs a 6um thick, Sn 63 / Pb 37 Solderable interface as part of the 50m high solder bump. These chips are designed to be soldered... |
| Description |
AlGaAs Solder Bump Flip-Chip PIN Diode
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| File Size |
123.06K /
5 Page |
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it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MADP-000910-13050T MA4AGCP910 MA4AGFCP910
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| OCR Text |
...nd placed with a #27 tip vacuum pencil.
Assembly Requirements using Electrically Conductive Ag Epoxy and Solder
These chips are designed to be inserted onto hard or soft substrates with the junction side down. They should be mounted ont... |
| Description |
AlGaAs Flip-Chip PIN Diode 100MHz to 50GHz
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| File Size |
124.12K /
6 Page |
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it Online |
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MACOM[Tyco Electronics]
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| Part No. |
MADS-001317-1320AG
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| OCR Text |
...matically with a #27 tip vacuum pencil.
Assembly Requirements using Tin Lead Solder
This Flip Chip Diode employs a 6um thick, Sn 63 / Pb 37 Solderable interface as part of the 50m high solder bump. These chips are designed to be soldere... |
| Description |
GaAs Solder Bump Flip Chip Schottky Diode
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| File Size |
109.97K /
3 Page |
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it Online |
Download Datasheet |
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NEC[NEC]
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| Part No. |
NL128102AC31-02
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| OCR Text |
...ned viewing direction Polarizer pencil-hardness Color gamut Response time Luminance Signal system : 85 (typ., up side, down side) perpendicular * Optimum grayscale (r = 2.2): 3H (min., at JIS K5400) 60 % (typ., at center, to NTSC) 45 ms (ty... |
| Description |
TFT COLOR LCD MODULE
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| File Size |
1,559.55K /
24 Page |
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it Online |
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TRIQUINT[TriQuint Semiconductor]
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| Part No. |
TGA4802-EPU
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| OCR Text |
...nt Pickup and Placement: Vacuum pencil and/or vacuum collet preferred method of pick up Avoidance of air bridges during placement Force impact critical during auto placement Interconnect: Thermosonic ball bonding is the preferred interconne... |
| Description |
12.5GB/S IRZ Modulator Driver
12.5Gb/s Modulator Driver Amplifier
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| File Size |
160.49K /
10 Page |
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it Online |
Download Datasheet |
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Price and Availability
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