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Murata Manufacturing Co...
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Part No. |
NFM31HK223R1H3
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OCR Text |
... soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. 1) printing of adhesive adhesive amount shall be about 0.06mg per chip to obtain enough adhesive strength. the adhesive po... |
Description |
This product specification is applied to Chip EMIFIL
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File Size |
500.70K /
11 Page |
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it Online |
Download Datasheet |
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TAITRON
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Part No. |
RC0805
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OCR Text |
....05 ? ) (1.0%+0.05 ? ) <50m ? leaching jis c 5201 4.18 iec 60115 4.18 2605c for 60 seconds no leaching solderability jis c 5201 4.17 iec 60115-1 4.17 2455c for 3 seconds. >95% coverage endurance at upper category temperature ... |
Description |
Thick Film Chip Resistor General Purpose
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File Size |
579.84K /
7 Page |
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it Online |
Download Datasheet |
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TAITRON
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Part No. |
RC1206
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OCR Text |
....05 ? ) (1.0%+0.05 ? ) <50m ? leaching jis c 5201 4.18 iec 60115 4.18 2605c for 60 seconds no leaching solderability jis c 5201 4.17 iec 60115-1 4.17 2455c for 3 seconds. >95% coverage endurance at upper category temperature ... |
Description |
Thick Film Chip Resistor General Purpose
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File Size |
579.89K /
7 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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