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joint Datasheet PDF File

For joint Found Datasheets File :: 5477 Search Time::1.516ms
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				LIGITEK electronics co., ltd.
Part No.	LA208B-SRG-1-PF
OCR Text	...ax Distance:2mm Min(From solder joint to case) Page5/6 Temp(C) 245C 5sec Max 245 120 Preheat 2/sec max 2/sec max 2/sec max Time(sec) 120 Seconds Max Dip Soldering Preheat: 120 C Max Preheat time: 120 seconds Max Ramp...
Description	LED ARRAY
File Size	86.53K / 7 Page	View it Online	Download Datasheet

				Microsemi Corporation
Part No.	ARF477FL
OCR Text	...o Sink (High Efficiency Thermal joint Compound and Planar Heat Sink Surface.) Min Typ 0.18 0.30 Max 0.2 0.32 Unit C/W 050-4952 A 5-2009 CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should B...
Description	RF POWER MOSFET N-CHANNEL PUSH - PULL PAIR
File Size	150.66K / 4 Page	View it Online	Download Datasheet

				Lumberg
Part No.	0321 032105-1 032103 032104 032106 032107-1 032108-1 032112 032114
OCR Text	joint acc. to IEC 60130-9, IP 68 Connecteurs circulaires avec verrouillage a vis suivant CEI 60130-9, IP 68 0321 Kupplung nach IEC 60130-9, IP 68, mit Schraubverschluss und Lotanschlussen 1. Temperaturbereich 2. Werkstoffe Kontakttrager K...
Description	Rundsteckverbinder mit Schraubverschluss nach IEC 60130-9, IP 68
File Size	525.84K / 2 Page	View it Online	Download Datasheet

				Sanyo Semicon Device
Part No.	LV8741V
OCR Text	...ual product. Confirm the solder joint state and verify also the reliability of solder joint for the Exposed Die-Pad, etc. Any void or deterioration, if observed in the solder joint of these parts, causes deteriorated thermal conduction, pos...
Description	Bi-CMOS LSI PWM Constant-Current Control Stepping Motor Driver
File Size	191.51K / 24 Page	View it Online	Download Datasheet

				NXP Semiconductors N.V.
Part No.	IP4338CX24_LF IP4338CX24 IP4338CX24/LF IP4338CX24/LF135 IP4338CX24/LF/P13
OCR Text	...hip. 9.3.2 Quality of solder joint A flip-chip joint is considered to be a good joint when the entire solder land has been wetted by the solder from the bump. The surface of the joint should be smooth and the shape symmetrical. The sold...
Description	10-channel integrated filter network with ESD input protection to IEC 61000-4-2 level 4
File Size	73.70K / 12 Page	View it Online	Download Datasheet

				Everlight Electronics Co., Ltd
Part No.	3474AN 3474AN/BADB-AFGA/PR/MS 3474AN_BADB-AFGA_PR_MS 3474AN_BADB-AFGA_R_MS
OCR Text	...leave more then 3mm from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is recommended. Recommended soldering conditions: Hand Soldering Temp. at tip of iron Soldering time Distance 300 Max. (30W Max.) 3 sec Max. 3...
Description	performance oval LED
File Size	115.37K / 10 Page	View it Online	Download Datasheet

				Lumberg
Part No.	03629707-1 03629708-1 03629706-1 03629705-1
OCR Text	...ersteller a Dichtung gasket joint d'etancheite b fur die Aufnahme von Crimpkontakten for reception of crimp contacts pour reception de contacts a sertir c Montagerichtung mounting direction direction de montage d Dichtung gasket join...
Description	Flansch-Einbaukupplung-Leergeh盲use nach IEC 60130-9 Flansch-Einbaukupplung-Leergeh?se nach IEC 60130-9 Flansch-Einbaukupplung-Leergeh?se nach IEC 60130-9
File Size	92.87K / 2 Page	View it Online	Download Datasheet

				LIGITEK electronics co., ltd.
Part No.	LI2040-PF
OCR Text	...ax Distance:2mm Min(From solder joint to case) 120X 25X Dip Soldering Preheat: 120 C Max Time(sec) Preheat time: 120 seconds Max Ramp-up 3 C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:245 C Max Dipping Time:5 seconds Max Dista...
Description	ROUND TYPE LED LAMPS
File Size	109.86K / 6 Page	View it Online	Download Datasheet

For joint Found Datasheets File :: 5477 Search Time::1.516ms
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