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ST Microelectronics STMICROELECTRONICS[STMicroelectronics]
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Part No. |
PLCC20
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OCR Text |
cmc 0.01 W/cmc
leadframe die attach
copper epoxy glue ( silver filler ) epoxy resin
0.25 mm 10-40 m
molding compound
3.6 mm
0.0063W/cmc
Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Rth(j-a) vs on board trace ar... |
Description |
PLCC 20
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File Size |
30.44K /
2 Page |
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it Online |
Download Datasheet
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ST Microelectronics STMICROELECTRONICS[STMicroelectronics]
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Part No. |
DIP40
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OCR Text |
cmc 0.01 W/cmc
leadframe die attach
copper epoxy glue ( silver filler ) epoxy resin
0.25 mm 10-40 m
molding compound
3.8 mm
0.0063W/cmc
Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time
September... |
Description |
Thermal Data
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File Size |
28.99K /
2 Page |
View
it Online |
Download Datasheet
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Atmel corp
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Part No. |
AT88SC1608NBSP AT88SC1608
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OCR Text |
...ode.
In the following table, cmc is the Card Manufacturer Code, and AR means the access rights are defined by the access registers.
Configuration Fabrication (Except cmc) Fabrication (Only cmc) Access Write Read Authentication Write Rea... |
Description |
16K EEPROM with Authentication; eight 2-Kbit zones From old datasheet system
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File Size |
248.70K /
20 Page |
View
it Online |
Download Datasheet
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Price and Availability
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