| |
|
 |
TI store
|
| Part No. |
TPSM831D31
|
| OCR Text |
... ? high-performance processor / asic with dual power rails ? networking processor power ( broadcom ? , cavium ? , marvell ? , nxp ? ) ? high-current fpga power ( intel ? , xilinx ? ) ? high-performance arm processor power 3 description the ... |
| Description |
<font color=red>[Old version datasheet]</font> 8-V to 14-V Input, 0.25-V to 1.52-V Dual Output, 120-A 40-A PMBus Power Module
|
| File Size |
1,014.00K /
78 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Freescale Semiconductor...
|
| Part No. |
MMA2244KEG
|
| OCR Text |
...and a cmos signal conditioning asic contained in a single integrated circuit package. the sensing element is sealed hermetically at the wafer level using a bulk micromachined ?cap? wafer. the g-cell is a mechanical structure formed from ... |
| Description |
Low G Micromachined Accelerometer
|
| File Size |
126.74K /
10 Page |
View
it Online |
Download Datasheet |
| |
|
|
Freescale Semiconductor...
|
| Part No. |
MMA2244EG MMA2244EGR2 MMA2244KEG MMA2244KEG-12 MMA2244KEGR2
|
| OCR Text |
...and a cmos signal conditioning asic contained in a single integrated circuit package. the sensing element is sealed hermetically at the wafer level using a bulk micromachined ?cap'' wafer. the g-cell is a mechanical structure formed from... |
| Description |
Low-g Micromachined Accelerometer
|
| File Size |
121.38K /
11 Page |
View
it Online |
Download Datasheet |
| |
|
|
Freescale Semiconductor...
|
| Part No. |
MMA2244EG MMA2244EGR2
|
| OCR Text |
...and a cmos signal conditioning asic contained in a single integrated circuit package. the sensing element is sealed hermetically at the wafer level using a bulk micromachined ?cap? wafer. the g-cell is a mechanical structure formed from ... |
| Description |
Low G Micromachined Accelerometer
|
| File Size |
228.98K /
10 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
|
