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  935.2 Datasheet PDF File

For 935.2 Found Datasheets File :: 37    Search Time::1.484ms    
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    Philips
Part No. TDA935X
OCR Text ... Closed captioning 9350 9351 9352 9353 9360 9361 9362 9363 9364 9365 9366 9367 9380 9381 9382 9383 9384 9385 9386 9387 9388 9389 90 90 90 110 90 90 110 110 110 110 90 90 90 90 90 110 110 110 110 90 110 110 ...
Description TV Signal Processor-Teletext Decoder with Embedded u-Controller

File Size 525.25K  /  118 Page

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    LINK-51 51LPCLINK-51 LINK-51SD

NXP
Philips Semiconductors
Part No. LINK-51 51LPCLINK-51 LINK-51SD
OCR Text ... Part Number: LINK-51 SD 12NC: 9352-635-58112 Assembler * Shareware for 8051 Monitor * Status * emNET monitoring * Development debugging tool emWARE Certified 3rd-Party Products EMIT is compatible with the following: * TASKING...
Description 51LPC Evaluation Kit

File Size 91.20K  /  2 Page

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    HTCM400 HTCM400/EAE

NXP Semiconductors
Part No. HTCM400 HTCM400/EAE
OCR Text ...G core module ORDER CODE (12NC) 9352 339 00122 HTCM400/EAE 2001 Oct 04 3 Philips Semiconductors Product specification HITAG core module hardware 5 BLOCK DIAGRAM HTCM400 handbook, full pagewidth power supply E...
Description HITAG core module hardware

File Size 110.08K  /  24 Page

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    BYG22A BYG22D BYG22 BYG22B

Vishay Telefunken
VISAY[Vishay Siliconix]
Vishay Intertechnology,Inc.
Part No. BYG22A BYG22D BYG22 BYG22B
OCR Text ...7 0.01 40 80 120 160 200 94 9352 0 0.6 1.2 1.8 2.4 3.0 Tj - Junction Temperature ( C ) VF - Forward Voltage ( V ) Figure 1. Typ. Reverse Current vs. Junction Temperature Figure 3. Max. Forward Current vs. F...
Description Super Fast Silicon Mesa SMD Rectifier
From old datasheet system

File Size 58.61K  /  5 Page

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    PHILIPS[Philips Semiconductors]
Part No. HTCM400 HTCM400_2 HTCM400_EAE HTCM400/EAE
OCR Text ...G core module ORDER CODE (12NC) 9352 339 00122 HTCM400/EAE 2001 Oct 04 3 Philips Semiconductors Product specification HITAG core module hardware 5 BLOCK DIAGRAM HTCM400 handbook, full pagewidth power supply EE...
Description HITAG core module hardware
From old datasheet system

File Size 104.77K  /  24 Page

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    MF1ICS5005 MF1ICS5005V1D MF1ICS5005W1D

Philips Semiconductors
Part No. MF1ICS5005 MF1ICS5005V1D MF1ICS5005W1D
OCR Text ... code: mf1ics5005w/v1d 12nc: 9352 774 55005 note: substrate is connected to vss. 1 pads vss and testio are disconnected when wafer is sawn. philips semiconductors produ ct specificati...
Description Standard Card IC Specification B>bumped sawn wafer on UV-tape

File Size 33.19K  /  7 Page

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    SLRM900AFB SLRM900 SLRM900_AFB SLRM900_2 SLRM900/AFB

PHILIPS[Philips Semiconductors]
NXP Semiconductors
Part No. SLRM900AFB SLRM900 SLRM900_AFB SLRM900_2 SLRM900/AFB
OCR Text ...der module ORDERING CODE (12NC) 9352 623 27122 SLRM900/AFB 2002 May 24 3 Philips Semiconductors Product specification I-CODE Long range reader module hardware 5 BLOCK DIAGRAM SLRM900 handbook, full pagewidth RF B...
Description From old datasheet system
I-CODE Long range reader module hardware

File Size 79.52K  /  16 Page

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    NXP Semiconductors N.V.
Part No. MF0ICU1001W
OCR Text ...ng code mf0 moa4 u10 / d 12 nc: 9352 817 85118 120931 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 3.1 ? 7 february 2007 2 of 5 nxp semiconductors mf0 moa4 u10 mifare ultralight contactless chip card module 6. limiting v...
Description 120 micro m Bumped sawn wafer on UV-tape contactless single-trip ticket ICs

File Size 43.48K  /  5 Page

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