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  90571-2141 Datasheet PDF File

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    http://
Part No. 90571-2342
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, 34 Circuits, 0.76 μm Gold (Au)

File Size 350.67K  /  5 Page

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Amphenol Communications Solutions

Part No. 10137785-052141LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Gold Flash plating, Natural Color, 5 Positions, Non GW Compatible, with Post, Tray packing.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    MOLEX INC
Part No. 90571-2169
Description 16 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER

File Size 40.08K  /  1 Page

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Amphenol Communications Solutions

Part No. 54121-410041600LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Molex, Inc.
Part No. 90571-1261
Description QF50 Srd Hdr Vt W/ELv Yel .1Au 26Ckt 26 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER

File Size 247.98K  /  2 Page

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Amphenol Communications Solutions

Part No. 54121-419041650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

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Part No. 90571-2409
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, 40 Circuits, Tin

File Size 350.59K  /  5 Page

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Amphenol Communications Solutions

Part No. 91910-21415LF
Description Conan® 1.00mm Pitch, Board To Board Connector, I - Industrial Series, Vertical Header, Surface Mount, 15 Positions, 1.00mm ( 0.039in) Pitch.
Tech specs    

Official Product Page

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Part No. 90571-2109
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, 10 Circuits, Tin

File Size 350.59K  /  5 Page

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Amphenol Communications Solutions

Part No. 91900-21411LF
Description Conan® 1.00mm Pitch, Board To Board Connector, I - Industrial Series, Conan Vertical Header, Surface Mount, 11 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

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Part No. 90571-2149
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, 14 Circuits, Tin

File Size 350.59K  /  5 Page

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Amphenol Communications Solutions

Part No. 61082-141402LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 140 Positions.
Tech specs    

Official Product Page

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Part No. 90571-2161
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, 16 Circuits, 0.1 μm Gold (Au)

File Size 358.77K  /  5 Page

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Amphenol Communications Solutions

Part No. 79821-412HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 12 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
Tech specs    

Official Product Page

    http://
Part No. 90571-2263
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, 26 Circuits, 0.25 μm Gold (Au)

File Size 350.67K  /  5 Page

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Amphenol Communications Solutions

Part No. 54121-416063050LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90571-1601

Molex Electronics Ltd.
Part No. 90571-1601
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 60 Circuits, 0.1 μm Gold (Au)

File Size 282.87K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-3214-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    90571-1641

Molex Electronics Ltd.
Part No. 90571-1641
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 64 Circuits, 0.1 μm Gold (Au)

File Size 282.88K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-8214-11D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 4 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

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