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  75757-0331 Datasheet PDF File

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    75757-1402

Molex Electronics Ltd.
Part No. 75757-1402
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 20 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 4.75mm (.187) PC Tail Length

File Size 166.38K  /  4 Page

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Rochester Electronics LLC

Part No. 100331/VYA
Description 100331 - 100K Series, Low Power Triple D-Type Flip-Flop - Dual marked (5962-9153601VYA) - SPACE-LEVEL LOGIC
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    75757-0361

Molex Electronics Ltd.
Part No. 75757-0361
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 99.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 68033-122HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 22 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs    

Official Product Page

    75757-0362

Molex Electronics Ltd.
Part No. 75757-0362
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 99.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 68033-121HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs    

Official Product Page

    75757-5281

Molex Electronics Ltd.
Part No. 75757-5281
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 158.58K  /  4 Page

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Amphenol Communications Solutions

Part No. 10106813-033112LF
Description 0.5 mm Pitch Hermaphroditic Mezzanine Connector, 30 positions, Standard length with pegs and hold-downs, Half of mated height equals 3 mm
Tech specs    

Official Product Page

    75757-5481

Molex Electronics Ltd.
http://
Part No. 75757-5481
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 16 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 16.09mm (.633) Mating Pin Length, 3.05mm (.120) PC Tail Length

File Size 166.20K  /  4 Page

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Amphenol Communications Solutions

Part No. 74033-103LF
Description 74033-103LF-BLACK 30AU LF
Tech specs    

Official Product Page

    75757-1382

Molex Electronics Ltd.
Part No. 75757-1382
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 0.75μm(30μ) Select Gold (Au) Plating, 11.20mm (.441) Mating Pin Length, 4.75mm (.187)

File Size 166.47K  /  4 Page

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Amphenol Communications Solutions

Part No. UE86L462700331
Description ExpressPort SFP+, High Speed Input Output Connectors, 2X4SFP EXP PRT LRGR LP DIA.
Tech specs    

Official Product Page

    75757-1481

Molex Electronics Ltd.
Part No. 75757-1481
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length

File Size 166.43K  /  4 Page

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Amphenol Communications Solutions

Part No. 10137785-033111LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, Nylon 66, 15u\\ Gold (Tin on Tails) plating, Natural Color, 3 Positions, GW Compatible, with Post, Tray packing.
Tech specs    

Official Product Page

    http://
Part No. 75757-5401
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 20 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 16.09mm (.633) Mating Pin Length, 3.05mm (.120) PC Tail Length

File Size 166.19K  /  4 Page

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Amphenol Communications Solutions

Part No. 68033-113HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs    

Official Product Page

    http://
Part No. 75757-5421
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 16.09mm (.633) Mating Pin Length, 3.05mm (.120) PC Tail Length

File Size 166.19K  /  4 Page

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Amphenol Communications Solutions

Part No. 68033-128HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 28 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs    

Official Product Page

    http://
Part No. 75757-5461
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 12 Circuits, 1.5μm (60u) Tin (Sn) Plating

File Size 166.20K  /  4 Page

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Amphenol Communications Solutions

Part No. 68033-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs    

Official Product Page

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