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Texas Instruments |
Part No. |
MSP430F6458IPZ
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Description |
MSP430F64xx Mixed Signal Microcontroller 100-LQFP -40 to 85
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
86092645814745ELF
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Description |
DIN Straight Header Solder-to-Board Style Q 64 ways, Class III
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
86092645814755E1LF
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Description |
Header, Vertical, Through Hole, Style Q, 64 ways, Class Il
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
86092645815765ELF
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Description |
DIN Straight Header Solder-to-Board Style R 64 ways, Class I
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
67996-458HLF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 58 Positions, 2.54 mm (0.100in) Pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
86092645814755ELF
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Description |
Din Headers and Receptacles, Backplane connectors, Straight Header Solder-to-Board Style Q 64 ways, Class II, Tail Length: 4mm
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
71308-5480
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Description |
2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 80 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 80 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
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File Size |
1,475.55K /
8 Page |
View
it Online |
Download Datasheet |
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SiTime |
Part No. |
SiT8503ai-13-28e-645.830
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Description |
Low Frequency Oscillator
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Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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