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  557-1303-203 Datasheet PDF File

For 557-1303-203 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    MT1303-HR-A

Marktech Corporate
Part No. MT1303-HR-A
Description Ultra Bright LEDs
File Size 165.53K  /  3 Page

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Coilcraft Inc
Part No. 13031CL
Description Power choke, toroid, RoHS
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    Marktech Optoelectronics
Part No. MT1303-HR
Description Ultra Bright LEDs
File Size 382.48K  /  2 Page

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Amphenol Communications Solutions
Part No. 130-3162-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Daughtercard Module, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    Samtec, Inc
Part No. ASP-130368-01
Description NOT AVAILABLE AS STANDARD.
File Size 373.83K  /  2 Page

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Amphenol Communications Solutions
Part No. 130-3162-15H
Description Paladin Plus 3-Pair, 6 Column, Right Angle Receptacle, Signal Module, APP
Tech specs 　 　

Official Product Page

    Samtec, Inc
Part No. ASP-130366-01
Description CONTACT CONFIGURATION NOT AVAILABLE AS STANDARD
File Size 404.12K  /  2 Page

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Amphenol Communications Solutions
Part No. 130-3182-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Daughtercard Module, APP.
Tech specs 　 　

Official Product Page

    MARKTECH[Marktech Corporate]
Part No. MT1303-UHR
Description Ultra Bright Red 3mm LED
File Size 371.47K  /  2 Page

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Amphenol Communications Solutions
Part No. 130-3142-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, APP.
Tech specs 　 　

Official Product Page

    Marktech Optoelectronics
Part No. MT1303-UHR
Description Ultra Bright LEDs
File Size 385.80K  /  2 Page

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Amphenol Communications Solutions
Part No. 130-3182-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Daughtercard Module, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    451303 4514

Renesas Electronics Corporation
Part No. 451303 4514
Description 4-BIT SINGLE-CHIP MICROCOMPUTER
File Size 1,717.28K  /  210 Page

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Amphenol Communications Solutions
Part No. 130-3142-15D
Description Paladin Plus 3-Pair, 4 Column, Right Angle Receptacle, Signal Module, NiS
Tech specs 　 　

Official Product Page

    TQ1303-1308

TriQuint Semiconductor
Part No. TQ1303-1308
Description Splitter Family (700-2200 MHz)
File Size 49.01K  /  6 Page

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Amphenol Communications Solutions
Part No. 130-3182-15H
Description Paladin Plus 3-Pair, 8 Column, Right Angle Receptacle, Signal Module, APP
Tech specs 　 　

Official Product Page

    14-44-2909 A-70475-1303

Molex Electronics Ltd.
Part No. 14-44-2909 A-70475-1303
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 0.76μm (30μ) Gold (Au), 9 Circuits
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 0.76μm (30μ) Gold (Au), 9 Circuits
File Size 141.38K  /  2 Page

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Amphenol Communications Solutions
Part No. 130-3162-15D
Description Paladin Plus 3-Pair, 6 Column, Right Angle Receptacle, Signal Module, NiS
Tech specs 　 　

Official Product Page

    VSKDS203/100

Vishay Siliconix
Part No. VSKDS203/100
Description ADD-A-PAK Generation VII
File Size 231.67K  /  7 Page

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Amphenol Communications Solutions
Part No. 130-3142-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

For 557-1303-203 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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