| |
|
 |
|
| Part No. |
ST27256-25CP
|
| Description |
Programmable Logic IC; Logic Type:Programmable; Package/Case:208-PQFP; Leaded Process Compatible:No; Number of Circuits:1728; Peak Reflow Compatible (260 C):No; Mounting Type:surface mount RoHS Compliant: No
|
| File Size |
596.53K /
10 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Rochester Electronics LLC |
| Part No. |
MD27256-20/B
|
| Description |
27256 - 256K (32K x 8) UV Erasable PROM
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Rochester Electronics LLC |
| Part No. |
MR27256-25/B
|
| Description |
27256 - 256K (32K x 8) UV Erasable PROM
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Rochester Electronics LLC |
| Part No. |
MC27256-35/BYA
|
| Description |
27256 - 32K X 8 EPROM -Dual marked (8411101YA)
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Rochester Electronics LLC |
| Part No. |
MC27256-17/BYA
|
| Description |
27256 - 32K X 8 EPROM -Dual marked (8411104YA)
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Rochester Electronics LLC |
| Part No. |
MD27256-17/B
|
| Description |
27256 - 256K (32K x 8) UV Erasable PROM
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
77311-427-25LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 25 Positions, 2.54 mm Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
77311-127-25LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 25 Positions, 2.54 mm Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
77311-827-25LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 25 Positions, 2.54 mm Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|
