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  TIM3.5-1223 Datasheet PDF File

For TIM3.5-1223 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    TIM3742-16SL

Toshiba Semiconductor
Part No. TIM3742-16SL
Description
File Size 127.74K  /  4 Page

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Amphenol Communications Solutions

Part No. 75168-122-30LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    TOSHIBA[Toshiba Semiconductor]
Part No. TIM3742-35SL
Description MICROWAVE POWER GaAs FET

File Size 490.88K  /  4 Page

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Amphenol Communications Solutions

Part No. 77313-122-32LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 32 Positions
Tech specs    

Official Product Page

    Toshiba Corporation
Part No. TIM3742-25UL
Description MICROWAVE POWER GaAs FET

File Size 45.67K  /  4 Page

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Amphenol Communications Solutions

Part No. 77311-122-34LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    TOSHIBA[Toshiba Semiconductor]
Part No. TIM3742-25UL
Description MICROWAVE POWER GaAs FET

File Size 44.60K  /  4 Page

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Amphenol Communications Solutions

Part No. 10131931-223ULF
Description Minitek®, Board to Board, Receptacle, Surface Mount, Single row, 23 Positions, 2mm (0.079inch), horizontal.
Tech specs    

Official Product Page

    TIM3438-12UL

Toshiba Semiconductor
Part No. TIM3438-12UL
Description HIGH POWER P1dB=41.5dBm at 3.4GHz to 3.8GHz

File Size 117.82K  /  4 Page

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Amphenol Communications Solutions

Part No. 77313-122-30LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 30 Positions
Tech specs    

Official Product Page

    TOSHIBA[Toshiba Semiconductor]
Part No. TIM3742-12UL
Description MICROWAVE POWER GaAs FET

File Size 44.62K  /  4 Page

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Amphenol Communications Solutions

Part No. 77315-122-36LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    Toshiba Corporation
Part No. TIM3438-16SL
Description MICROWAVE POWER GaAs FET

File Size 39.75K  /  2 Page

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Amphenol Communications Solutions

Part No. RJE721881223
Description Modular Jack - High Performance, Input Output Connectors 8P8C, Shield, With LEDs.
Tech specs    

Official Product Page

    Toshiba Corporation
Part No. TIM3742-35SL
Description MICROWAVE POWER GaAs FET

File Size 453.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 10083987-41223TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Integrated Type, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    TOSHIBA[Toshiba Semiconductor]
Part No. TIM3438-16SL
Description MICROWAVE POWER GaAs FET

File Size 39.63K  /  2 Page

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Amphenol Communications Solutions

Part No. 10085429-41223TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Integrated R-Type, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    TIM3742-16UL

Toshiba Semiconductor
Part No. TIM3742-16UL
Description HIGH POWER P1dB=42.5dBm at 3.7GHz to 4.2GHz

File Size 44.99K  /  4 Page

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Amphenol Communications Solutions

Part No. 75160-122-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,36 position, 2.54mm pitch
Tech specs    

Official Product Page

For TIM3.5-1223 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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